PCB Resin Composition Balancing Heat Resistance and Drillability
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Solution Overview
Problem
Existing resin compositions for printed wiring boards lack both heat resistance and drillability, particularly in terms of bit breakage resistance and hole position accuracy during via hole drilling.
Innovation Solution
A resin composition comprising a curable resin, an acrylic-monomer copolymer, an inorganic filler with a molybdenum compound on its surface, and another inorganic filler, along with optional core-shell rubber, to enhance both heat resistance and drillability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a resin composition containing maleimide compound and benzoxazine compound is used to form an insulating layer, then heat resistance is improved, but drillability deteriorates (increased bit breakage and reduced hole position accuracy)
Solution Approach 1:
The patent uses a composite resin system combining maleimide compound (A), benzoxazine compound (B), and phenolic compound (D) in specific ratios (A: 30-70 wt%, B: 10-50 wt%, D: 5-30 wt%). This composite approach balances heat resistance from maleimide and benzoxazine with drillability improvement from phenolic compound, resolving the contradiction between thermal performance and manufacturability.
Solution Approach 2:
The patent optimizes the molecular weight of the maleimide compound (A1) to be 150-500 g/mol and controls the glass transition temperature (Tg) of the cured resin to 180-250°C. These parameter adjustments ensure the resin achieves sufficient heat resistance while maintaining appropriate softness and chip evacuation properties for good drillability.
2Temperature
If the insulating layer is made with conventional resin composition, then heat resistance can be achieved, but bit breakage resistance deteriorates
Solution Approach 1:
The patent controls the glass transition temperature (Tg) of the cured resin to be 180-250°C, which optimizes the balance between heat resistance and drillability. This temperature parameter range ensures the resin is soft enough during drilling to reduce bit breakage while maintaining sufficient heat resistance for high-temperature applications.
Solution Approach 2:
The patent introduces a phenolic compound (D) specifically to improve drillability and bit breakage resistance, while maleimide (A) and benzoxazine (B) compounds provide the heat resistance. Each component serves a localized function, with phenolic compound acting as a drillability enhancer that doesn't compromise the heat resistance provided by the other components.
3Temperature
If the insulating layer is made with conventional resin composition, then heat resistance can be achieved, but hole position accuracy deteriorates
Solution Approach 1:
The patent optimizes the molecular weight of the maleimide compound (A1) to be 150-500 g/mol and controls the glass transition temperature to 180-250°C. These parameter settings create a resin with optimal viscosity and chip evacuation properties during drilling, which directly improves hole position accuracy while maintaining heat resistance.
Solution Approach 2:
The composite resin system combining maleimide, benzoxazine, and phenolic compounds in specific ratios creates a material that simultaneously provides heat resistance and improved drilling characteristics. The phenolic compound component specifically enhances chip evacuation and reduces drill bit deflection, leading to better hole position accuracy.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves improved heat resistance and drillability, reducing drill bit breakage and enhancing hole position accuracy in printed wiring boards.
Implementation Method 1
a molybdenum compound is present on at least a part of a surface of the inorganic filler (C)
Implementation Method 2
a curable resin (A)
Data Source
AI summary
A resin composition contains: a curable resin (A); an acrylic-monomer copolymer (B) having a structure expressed by formulae (1) to (3) and having a weight average molecular weight equal to or greater than 10,000 and equal to or less than 900,000; an inorganic filler (C) where a molybdenum compound is present on at least a part of a surface thereof; and another inorganic filler (D) different from the inorganic filler (C). R1 is either a hydrogen atom or a methyl group. R2 includes at least one of a glycidyl group or an epoxidized alkyl group which is selected from the group consisting of a hydrogen atom, an alkyl group, the glycidyl group, and the epoxidized alkyl group. R3 is either a hydrogen atom or a methyl group. R4 is Ph (phenyl group), —COOCH2Ph, or —COO(CH2)2Ph.