Halogen-Free PCB Resin Composition for Peel Strength and Moisture Resistance
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Solution Overview
Problem
Current resin compositions for printed wiring boards face challenges in achieving sufficient low water absorbency, moisture absorption heat resistance, and flame retardancy, with existing solutions either insufficient in heat resistance or generating harmful substances during combustion.
Innovation Solution
A resin composition comprising a cyanate compound, a maleimide compound, and a benzoguanamine compound with an aminomethyl group, which improves copper foil peel strength and plating peel strength while avoiding the use of halogen-based compounds, thereby enhancing thermal and chemical resistance without generating harmful substances during combustion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a bisphenol A-based cyanate compound is used, then electrical characteristics and mechanical characteristics are improved, but water absorbency and moisture absorption heat resistance are insufficient
Solution Approach 1:
The patent uses a composite resin system combining cyanate compound (A), maleimide compound (B), and benzoguanamine compound (C) to achieve both low water absorbency and excellent electrical characteristics. The composite formulation allows the cyanate compound to provide electrical performance while the maleimide and benzoguanamine compounds contribute to reduced water absorption and improved moisture heat resistance.
2Adaptability or versatility
If a novolac-based cyanate compound is used, then structural diversity is improved, but curability is insufficient and water absorption rate increases
Solution Approach 1:
The patent changes the chemical parameters by introducing a benzoguanamine compound with specific structural features (formula 1) that enhances curability. The compound's molecular structure parameters are optimized to ensure complete curing while maintaining structural diversity and controlling water absorption through the synergistic interaction with maleimide and cyanate compounds.
3Object-affected harmful factors
If a halogen-based compound is used, then flame retardancy is improved, but harmful substances such as dioxin are generated during combustion
Solution Approach 1:
The patent converts the traditional approach to flame retardancy by using non-halogen compounds. Instead of relying on halogen-based flame retardants that produce dioxin, the invention uses a combination of cyanate, maleimide, and benzoguanamine compounds that provide flame retardancy through alternative mechanisms while eliminating harmful dioxin generation during combustion.
4Strength
If surface treatment of filler is applied, then copper foil peel strength is improved, but heat resistance becomes insufficient
Solution Approach 1:
The patent employs a composite resin system where the combination of cyanate compound (A), maleimide compound (B), and benzoguanamine compound (C) provides both improved copper foil peel strength and sufficient heat resistance. The synergistic interaction among these compounds ensures that surface treatment effects on filler are maintained while achieving the required heat resistance performance.
Data Source
AI summary
A resin composition for a printed wiring board containing a cyanate compound (A); a maleimide compound (B); and a benzoguanamine compound (C) having an aminomethyl group represented by the following general formula (1):wherein R is a hydrogen atom or a substituent selected from a group consisting of a hydrocarbon group having 1 to 10 carbon atoms, an alkoxyl group having 1 to 10 carbon atoms, an aryloxy group having 6 to 10 carbon atoms, a hydroxyl group, an amide group, and a halogen atom, and n is an integer of 1 to 2.