PCB High-Voltage Resistor Assembly for Precise Electrode Alignment
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The production of high-voltage electrode assemblies is complex and costly due to manual assembly of individual components, leading to imprecise alignment and difficulty in cleaning, especially with elastically formable bands used in prior art designs.
Innovation Solution
Designing a high-voltage resistor arrangement with a rigid PCB board carrier substrate, where SMD components are soldered directly to the substrate using conductive connection surfaces, enabling fully automatic assembly and precise rasterization, eliminating the need for manual assembly and simplifying alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If manual assembly of individual components is used, then flexibility in assembly is maintained, but manufacturing complexity and cost increase significantly
Solution Approach 1:
The patent merges multiple individual components (resistors, connecting elements, insulating body) into a single integrated high-voltage resistor unit. The resistor body is formed as one piece with integrated connection elements and insulating structures, eliminating the need for manual assembly of separate components. This merging approach directly reduces manufacturing complexity while enabling automated production.
Solution Approach 2:
The single-piece resistor body performs multiple functions simultaneously: it provides electrical resistance, structural support, insulation, and mechanical connection interfaces. This multi-functionality eliminates the need for separate insulating bodies and connecting elements, reducing assembly steps and enabling automated manufacturing while maintaining design flexibility.
2Manufacturing precision
If elastically deformable strip is used for electrode arrangement, then flexibility in positioning is achieved, but alignment precision deteriorates
Solution Approach 1:
The connection elements are pre-integrated into the resistor body during manufacturing, with precisely positioned contact surfaces and mounting interfaces. This preliminary positioning ensures accurate electrode tip alignment is achieved automatically during assembly, eliminating the need for complex alignment procedures while maintaining the flexibility benefits of deformable strip configurations.
3Productivity
If manual soldering of components is used, then reliable galvanic connection is achieved, but production time and cost increase
Solution Approach 1:
The galvanic connections are integrated into the single-piece resistor body structure, with connection elements formed as integral parts of the resistor. This eliminates the need for separate soldering operations, enabling automated assembly while maintaining reliable electrical connections through precision-cast or precision-formed contact interfaces.
4Ease of manufacture
If individual components are assembled externally before installation, then assembly flexibility is maintained, but manufacturing complexity increases
Solution Approach 1:
The patent combines the resistor body, connection elements, and insulating structures into a single integrated component manufactured in one process. This eliminates the need for external assembly of semi-finished products and subsequent installation into insulating bodies, directly reducing manufacturing complexity while enabling straightforward automated production and installation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces manufacturing costs and ensures optimal alignment of electrode tips, allowing for efficient, cost-effective production of high-voltage resistor arrangements with improved precision and cleanliness in assembly.
Implementation Method 1
the individual resistors and/or the discrete capacitors are designed as surface-mount devices (SMDs) which are soldered directly onto the support substrate by means of solderable contact pads
Data Source
Figure 1~2
Figure 3
Figure 4
AI summary
The invention relates to a high-voltage resistor arrangement (9) with a rod-shaped support substrate (11) made of an electrically insulating material and a plurality of individual resistors (10) and/or discrete capacitors spaced apart from each other in the longitudinal direction of the support substrate (11), wherein at least one conductor track (12) extending in the longitudinal direction of the support substrate (11) is formed on the support substrate (11), which is galvanically connected to the individual resistors (10) and/or to the discrete capacitors, and wherein the individual resistors (10) and/or the discrete capacitors are designed as SMD components, which are soldered directly onto the support substrate (11) by means of solderable contact pads.