PCB Package Structure with Ring-Shaped Recesses for Gas Venting
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Solution Overview
Problem
Conventional printed circuit board manufacturing processes face inefficiencies due to excessive vertical tool movement and adhesive-induced stress, which reduces inductance values and can damage components during high-temperature processing, as gas expansion is not adequately managed.
Innovation Solution
A printed circuit board package structure featuring ring-shaped recesses and grooves that communicate through openings, allowing gas to escape and eliminating the need for adhesive, while the support layer covers the grooves to prevent contamination and enhance inductance values.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the cutting tool moves vertically to touch and cut the substrate for forming accommodation recesses, then the recesses can be formed, but lots of time is spent on vertical movements (ascent and descent) of the cutting tool
Solution Approach 1:
The patent changes the cutting path from vertical dimension (up and down movements) to horizontal dimension (continuous scanning movements). The forming machine head moves horizontally along X and Y axes to form accommodation recesses, eliminating repeated vertical ascents and descents, thereby improving manufacturing efficiency
2Stability of the object's composition
If adhesive is used to fix the cores in the accommodation recesses, then the cores are fixed, but the adhesive generates stress after being cured which reduces inductance value of the cores
Solution Approach 1:
The patent extracts and eliminates the adhesive from the system by designing accommodation recesses with integrated fixing structures (protrusions and recesses) that mechanically secure the cores without requiring adhesive, thereby avoiding stress-induced inductance reduction
Solution Approach 2:
The patent merges the fixing function into the accommodation recess structure itself by forming protrusions on the substrate that integrate with the cores, combining the recess and fixing mechanism into a single integrated structure
3Stability of the object's composition
If adhesive is used to fix the cores, then the cores are fixed, but gas in the accommodation recesses may expand due to high temperature in the infrared reflow oven which may damage the glass fibers and epoxy
Solution Approach 1:
The patent removes the adhesive that traps gas, and the integrated fixing structure allows gas expansion without causing damage to the glass fibers and epoxy during infrared reflow processing
Solution Approach 2:
The patent designs the accommodation recess with integrated fixing protrusions that provide a stress-relief mechanism beforehand, cushioning against gas expansion pressure during high-temperature processing to prevent damage
4Stability of the object's composition
If ring-shaped cores are placed into accommodation recesses and epoxy is filled to fix them, then the cores are secured, but the process complexity increases with multiple steps
Solution Approach 1:
The patent merges the recess formation and core fixing functions into a single integrated structure with protrusions, eliminating the separate epoxy filling step and reducing process complexity
Data Source
AI summary
A printed circuit board package structure includes a substrate, plural ring-shaped magnetic elements, a support layer, and first conductive layers. The substrate has two opposite first and second surfaces, first ring-shaped recesses, and first grooves. Each of the first ring-shaped recesses is communicated with another first ring-shaped recess through at least one of the first grooves, and at least two of the first ring-shaped recesses are communicated with a side surface of the substrate through the first grooves to form at least two openings. The ring-shaped magnetic elements are respectively located in the first ring-shaped recesses. The support layer is located on the first surface, and covers the first ring-shaped recesses and the first grooves. The support layer and the substrate have through holes. The first conductive layers are respectively located on surfaces of support layer and substrate facing the through holes.