Embedded PCB Rivet Structure for Reliable Bus Bar Connections

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Solution Overview

Problem

Existing connection mechanisms for external conductors like bus bars with printed circuit boards (PCBs) face issues such as stress development, conductive burrs, and reliability concerns with press-fit connectors, while soldered connections lack sustainability and require additional verification and insulation.

Innovation Solution

A connection structure using a stack-based arrangement of electrically conducting and insulating layers with an embedded rivet, where the rivet's upper section extends through the layers and its bottom section is laterally embedded, allowing for a metallic post to receive and connect external conductors, utilizing a friction riveting process for secure anchoring without surface preparation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If press-fit connectors are used to connect external conductors with PCB, then mechanical connection is achieved, but stress develops in the PCB and connection reliability deteriorates over time

Engineering Contradiction:
Improveconnection strengthVSAvoidconnection reliability
Core Design Contradiction:
StrengthVSReliability

Solution Approach 1:

The connection structure is divided into distinct functional segments: the rivet body embedded in the PCB, the protruding portion for external conductor attachment, and the insulated bore. This segmentation allows each component to perform its specific function optimally without compromising the other, resolving the contradiction between connection strength and reliability.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The rivet is nested within the PCB structure, with the protruding portion extending from the PCB surface. The external conductor is then attached to this protruding portion, creating a nested arrangement where the rivet is embedded in the PCB and the conductor is mounted on the rivet. This nested structure distributes stress effectively and maintains long-term connection reliability.

Inventive Principle:
Principle #7Nested doll (Nesting)

2Reliability

If press-fit connectors are used, then electrical connection is established, but conductive burrs are produced that interfere with conduction pathways

Engineering Contradiction:
Improveelectrical conduction reliabilityVSAvoidconductive burrs
Core Design Contradiction:
ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The harmful conductive burrs are extracted or removed from the system by using a rivet-based mechanical connection instead of press-fit connectors. The rivet process does not generate conductive burrs, thereby eliminating this harmful factor while maintaining reliable electrical conduction through the designated conductive pathways.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The invention converts the potential harm of burr generation into a benefit by selecting a rivet-based process that inherently avoids burr creation. The mechanical riveting process deforms the rivet material plastically to create a secure connection without generating conductive debris that could interfere with electrical pathways.

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

3Strength

If through-bore arrangement is used for press-fit connectors, then mechanical connection is achieved, but additional insulation provision is required at the bottom of PCB

Engineering Contradiction:
Improvemechanical connection strengthVSAvoidinsulation provision complexity
Core Design Contradiction:
StrengthVSDevice complexity

Solution Approach 1:

The insulation function is merged with the existing PCB structure by utilizing the insulating bore already present in the PCB. The rivet is inserted through this bore, and the protruding portion extends beyond the PCB surface. This merging of insulation and connection functions eliminates the need for separate insulation provisions while maintaining mechanical connection strength.

Inventive Principle:
Principle #5Merging (Combining)

4Reliability

If soldered connections are used for external conductors, then electrical connection is established, but sustainability is compromised and additional verification steps are required

Engineering Contradiction:
Improveelectrical connection reliabilityVSAvoidconnection sustainability
Core Design Contradiction:
ReliabilityVSDuration of action of stationary object

Solution Approach 1:

The chemical bonding mechanism of soldering is replaced with a mechanical riveting system. The rivet creates a secure mechanical connection through plastic deformation and friction, providing superior sustainability and durability compared to soldered joints. This mechanical substitution eliminates the need for additional verification steps while ensuring long-term connection reliability.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution reduces stress on the PCB, eliminates the need for press-fit connectors, and integrates the PCB and external conductor in a single assembly step, achieving reliable high-current connections with reduced size and cost, and avoids the demerits of traditional connectors.

Implementation Method 1

utilizing a friction riveting process for secure anchoring

Methodology Applied
Scientific EffectFriction: Friction

Implementation Method 2

friction riveting process for secure anchoring

Methodology Applied
Scientific EffectPlasticity: Plasticity

Data Source

PatentUS11897024B2Structure and mechanism for electrically-connecting an external-conductor
Publication Date: 2024.02.13 PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
  • US11897024B2 patent drawing
  • US11897024B2 patent drawing
  • US11897024B2 patent drawing

AI summary

The present disclosure relates to a structure for electrically-connecting an external conductor. The structure comprises a wiring-substrate comprising a stack based arrangement of a plurality of layers, wherein said layers are defined as electrically conducting layers and insulating layer. A rivet is supported from the wiring substrate and comprises an embedded portion within the wiring substrate. The embedded portion comprises: an upper section extending through the stack of the plurality of layers, and, a bottom section extending laterally with reference to the upper section. A portion protruding from wiring substrate is provided for receiving an external-conductor and for thereby electrically connecting with the wiring substrate.