Multi-Layer PCB Routing for Brushless Motor Efficiency
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Solution Overview
Problem
Current printed circuit boards (PCBs) for multi-phase brushless motors and LIDAR systems face challenges in efficiently routing current paths and maintaining reliable connections, which affects the motor's rotational efficiency and sensor system's directional accuracy.
Innovation Solution
The PCB design incorporates a first and second conductive layer with conductive vias that electrically couple ends of conductive paths at different radii, forming composite paths that make complete revolutions around the circumference, ensuring efficient current flow and mechanical coupling for motor rotation and sensor scanning.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional PCB routing is used for multi-phase brushless motors, then the circuit board structure is simple, but the motor's rotational efficiency deteriorates due to inefficient current paths
Solution Approach 1:
The PCB is divided into multiple conductive layers (first conductive layer, second conductive layer) with each layer containing specific conductive paths. Current paths are segmented across layers using conductive vias, allowing optimized routing for each phase while maintaining overall system efficiency.
Solution Approach 2:
The patent transitions from planar 2D routing to 3D multi-layer routing by stacking conductive layers vertically. Conductive paths extend through the PCB thickness dimension via conductive vias, enabling more efficient current paths that reduce resistance and improve motor rotational efficiency.
2Reliability
If complex multi-layer PCB design is implemented, then current flow efficiency is improved, but manufacturing complexity increases
Solution Approach 1:
The conductive vias serve multiple functions: they electrically connect conductive paths between layers, provide mechanical support, and enable the multi-layer structure to function as an integrated current routing system. This multi-functionality reduces the need for additional components or complex assembly steps.
Solution Approach 2:
The patent merges electrical connection functions across multiple layers by integrating conductive vias directly into the PCB structure during manufacturing. The conductive paths on different layers are combined through the vias to form complete current paths, eliminating the need for separate connection elements.
3Measurement precision
If radial conductive paths are used, then connection simplicity is maintained, but LIDAR directional scanning accuracy deteriorates
Solution Approach 1:
Different regions of the PCB are assigned different conductive path configurations tailored to local requirements. The motor winding areas use optimized multi-layer paths for electrical efficiency, while the LIDAR connection areas use precise radial paths for accurate directional scanning. Each local region has the quality needed for its specific function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the rotational efficiency of brushless axial-flux motors and maintains accurate directional scanning of LIDAR systems by ensuring reliable current paths and mechanical coupling, improving the overall performance of autonomous vehicles.
Implementation Method 1
a first plurality of conductive vias that pass through the PCB at the outer radius of the PCB and respectively electrically couple second ends of the first plurality of conductive paths to first ends of the second plurality of conductive paths
Data Source
AI summary
A printed circuit board (PCB) includes a first plurality of conductive paths having first ends at an inner radius of the PCB and second ends at an outer radius of the PCB. The PCB further includes a second plurality of conductive paths having first ends at an outer radius of the PCB and second ends at an inner radius of the PCB. The PCB further includes a first plurality of conductive vias that pass through the PCB at the outer radius of the PCB and couple second ends of the first plurality of conductive paths to first ends of the second plurality of conductive paths. The PCB further includes a second plurality of conductive vias that pass through the PCB at the inner radius of the PCB and electrically couple second ends of the second plurality of conductive paths to first ends of the first plurality of conductive paths.