PCB Routing Unit with Sub-Wire for Compact Data Transmission
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Solution Overview
Problem
The design of multi-layer printed circuit boards for computer devices faces challenges in minimizing the area occupied by wire structures, particularly for memory interfaces with parallel buses, leading to complexity and increased costs due to the need for additional layers and thicker boards.
Innovation Solution
A printed circuit board unit with a routing unit that includes a sub-wire to connect first and second components, allowing for data transmission between them, reducing the area required for wire structures by using a sub-wire formed on a surface or within a sub-board, and mounted on the main board to connect first and second wire units, thereby minimizing board size and thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a multi-layer printed circuit board is used to connect components with wire structures, then data transmission between components is enabled, but the area occupied by wire structures becomes remarkably large
Solution Approach 1:
The patent transitions from planar wire routing on the PCB surface to three-dimensional routing using vias through substrate layers. This allows wire structures to utilize the vertical dimension (Z-axis) by creating holes through the substrate and routing conductors along these vertical paths, thereby reducing the horizontal area occupied by wire structures while maintaining data transmission functionality.
Solution Approach 2:
The patent implements nested routing by placing wire structures inside substrate layers rather than on the surface. Conductors are embedded within the substrate thickness, with inner wires positioned at different depth levels. This nesting approach allows multiple wire structures to occupy the same horizontal footprint at different vertical positions, significantly reducing the overall area required for wire structures.
2Reliability
If additional layers are added to the printed circuit board to accommodate wire structures, then data transmission capability is improved, but manufacturing cost and board thickness increase
Solution Approach 1:
Instead of adding more horizontal layers to accommodate additional wire structures, the patent exploits the vertical dimension by creating through-substrate vias and routing conductors along the Z-axis. This allows data transmission capabilities to be enhanced using the existing substrate thickness rather than requiring additional manufacturing layers, thereby avoiding increased manufacturing costs and board thickness.
Solution Approach 2:
The patent segments the wire routing into multiple functional portions: entry wires on the surface, vertical via structures through the substrate, and inner wires at different depth levels. This segmentation allows complex data transmission paths to be achieved using the existing substrate structure rather than requiring additional complete layers, reducing manufacturing complexity and cost.
3Area of stationary object
If the printed circuit board size is reduced to make computer devices smaller, then device compactness is improved, but wire structure design becomes more complicated and difficult
Solution Approach 1:
The patent resolves the design complexity issue by utilizing the vertical dimension for wire routing. Instead of attempting to pack more wires into a smaller horizontal area (which would increase complexity), the invention routes wires through the substrate thickness using vias. This dimensional transition simplifies the design process for compact boards by providing an additional routing path that doesn't require complex lateral maneuvering.
Solution Approach 2:
The nested wire structure within substrate layers provides a systematic approach to routing multiple conductors in compact spaces. By organizing wires at different vertical levels within the substrate, the design complexity is reduced compared to attempting to route all wires on the surface, as the nested structure naturally manages spatial relationships and reduces routing conflicts.
Data Source
AI summary
A printed circuit board unit usable with a computer device includes a main board on which a first component and a second component are mounted on an upper surface, and a routing unit mounted on at least one of the upper surface and a lower surface of the main board and including a sub-wire forming at least part of a wire to transmit a data between the first component and the second component.