Differential Measurement Probe PCB Sandwich Design
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Solution Overview
Problem
Existing differential measurement probes for high-frequency signals are delicate, difficult to assemble, and handle, and often interfere with the signals being measured.
Innovation Solution
A robust differential measurement probe design featuring a sandwich-like arrangement of two support plates with printed circuit probe tips, which are mechanically supported and manufactured using standard PCB processes, incorporating multi-layer printed circuit boards with inner conductor and outer shielding layers for improved signal integrity and interference reduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional differential measurement probes are designed for high-frequency measurements, then measurement capability is improved, but device complexity and difficulty of assembly increase
Solution Approach 1:
The probe is divided into functionally independent modules: probe tips, support plates, and connector assemblies. Each module can be manufactured and tested separately using standard PCB processes, then assembled into the complete probe. This segmentation reduces overall device complexity while maintaining high-frequency measurement capability.
Solution Approach 2:
The support plates serve multiple functions: they provide mechanical support for the probe tips, establish electrical connections through contact pads, provide shielding for signal integrity, and enable alignment between components. This multi-functionality reduces the number of separate components needed, simplifying the overall device structure.
2Reliability
If traditional differential measurement probes are designed for high-frequency measurements, then measurement capability is improved, but ease of manufacture and handling deteriorate
Solution Approach 1:
The support plates are designed with integrated contact pads and alignment features that automatically guide the positioning of probe tips during assembly. The PCB-based construction allows standard manufacturing processes to self-align components, reducing the need for complex manual adjustment and assembly procedures.
Solution Approach 2:
Multiple functions are combined into the support plates: mechanical support, electrical connection, and shielding are integrated into a single PCB structure. This merging of functions into unified components simplifies the manufacturing process and improves ease of assembly compared to traditional multi-component probe designs.
3Measurement precision
If multi-layer PCB with shielding layers is used, then signal integrity is improved, but manufacturing complexity increases
Solution Approach 1:
The electrical properties of the PCB are optimized by controlling material parameters (dielectric constant, loss tangent) and geometric parameters (trace width, spacing, layer thickness) during the standard PCB manufacturing process. This allows high-frequency signal integrity to be achieved through parameter optimization rather than complex additional structures.
Solution Approach 2:
The probe utilizes composite construction combining PCB materials (for structural and electrical functions) with conductive materials (for shielding and contacts). This composite approach leverages the advantages of each material type while maintaining compatibility with standard manufacturing processes, avoiding the need for exotic or difficult-to-manufacture materials.
Data Source
AI summary
The present disclosure provides a differential measurement probe comprising a first support plate, a second support plate arranged in parallel to the first support plate, a first printed circuit probe tip that comprises a first contact section for contacting a device under test, and a second printed circuit probe tip that comprises a second contact section for contacting a device under test, wherein the first printed circuit probe tip and the second printed circuit probe tip are arranged between the first support plate and the second support plate and are mechanically supported by the first support plate and the second support plate.