Over-Molded PCB Seal Ring for TEC Moisture Protection

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Solution Overview

Problem

The use of multiple thermoelectric heaters/coolers (TECs) in a condensing environment faces challenges in preventing moisture ingress, which can cause damage and degradation, and existing solutions are costly and labor-intensive to assemble effectively.

Innovation Solution

A thermoelectric-based air conditioning system that incorporates a printed circuit board (PCB) and mold substrate to provide electrical connections between TECs while forming a seal to prevent moisture ingress, using a mold substrate to over-mold and retain the PCBs, thereby reducing assembly costs and increasing yields.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If multiple discrete TECs are used in a condensing environment, then the system can provide independent air conditioning control, but moisture ingress causes damage and degradation

Engineering Contradiction:

Improveindependent air conditioning controlVSAvoidmoisture protection

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

The PCB is nested within a recess of the mold substrate, and the seal ring is positioned within the mold substrate structure. This nested arrangement allows the PCB to be protected within the mold substrate while maintaining electrical connections to the TECs, creating a layered protective structure that prevents moisture ingress while preserving functionality

Inventive Principle:

Principle #7Nested doll (Nesting)

Solution Approach 2:

The mold substrate acts as an intermediary component between the PCB and the external condensing environment. It provides a protective barrier that prevents moisture from reaching the PCB and TECs while allowing the system to maintain independent air conditioning control in multiple zones

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If traditional sealing methods are used for TECs, then moisture protection is achieved, but assembly costs and labor time increase

Engineering Contradiction:

Improvemoisture protectionVSAvoidassembly cost and labor

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The mold substrate combines multiple functions into a single component: it provides structural support for the PCB, creates the sealing environment through its recess, and prevents moisture ingress. This merging of functions eliminates the need for separate sealing components and reduces assembly steps, lowering both cost and labor time while maintaining effective moisture protection

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The mold substrate serves multiple purposes simultaneously: it acts as a mounting structure for the PCB, provides a recess for nesting the PCB, creates a sealed environment, and protects against moisture. This multi-functionality simplifies the overall assembly process and reduces the number of parts needed, making manufacturing more economical

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Ease of operation

If PCB is exposed to condensing environment, then electrical connections are maintained, but moisture ingress degrades performance

Engineering Contradiction:

Improveelectrical connectionVSAvoidPCB moisture protection

Core Design Contradiction:

Ease of operationVSReliability

Solution Approach 1:

The PCB is nested within a recess of the mold substrate, creating a protective cavity that shields the PCB from the condensing environment. This nested structure allows the PCB to maintain its electrical connection function while being physically protected from moisture ingress through the seal ring and mold substrate barrier

Inventive Principle:

Principle #7Nested doll (Nesting)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively minimizes moisture ingress into TECs, reducing assembly time and costs while maintaining high system performance, with test results showing significantly reduced water vapor ingress and improved parasitic heat transfer.

Implementation Method 1

a mold substrate configured to over-mold the first and second TECs of the first and second TEC assemblies

Methodology Applied

Scientific EffectSealing:

Implementation Method 2

at least a first thermoelectric cooler (TEC) assembly forming at least a portion of the first supply air channel and configured to independently condition air

Methodology Applied

Scientific EffectJoule heating: Joule Heating

Data Source

PatentUS10161642B2System for over-molded PCB sealing ring for TEC heat exchangers

Publication Date: 2018.12.25 II VI DELAWARE INC

AI summary

A thermoelectric-based air conditioning system is provided. The system includes at least a first supply air channel and a separate second supply air channel disposed in a housing. The system also includes a first thermoelectric cooler (TEC) assembly forming at least a portion of the first supply air channel and configured to independently condition air within the first supply air channel. The system further includes a second TEC assembly forming at least a portion of the second supply air channel and configured to independently condition air within the second supply air channel. The system includes a printed circuit board (PCB) for each of the first and second TEC assembly, wherein each of the PCSs are configured to provide an electrical connection between a first TEC and a second TEC with each of the first and second TEC assemblies. The system further includes a mold substrate configured to over-mold the first and second TECs of the first and second TEC assemblies.