PCB Sectional Preshrinking for LCD Bonding Accuracy

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Solution Overview

Problem

Longer printed circuit boards (PCBs) in liquid crystal display products face preshrinking issues during bonding, leading to abnormal bonding and decreased production yield due to increased preshrinking values, which affect the edge positions and require special-shaped PCB designs that complicate layout routing.

Innovation Solution

A method for PCB sectional preshrinking that involves determining a preshrinking compensation value based on raw data and accuracy requirements, calculating sectional lengths, and optimizing the preshrinking design length to ensure precise bonding accuracy and yield, without needing special-shaped PCBs, by analyzing actual and theoretical expansion lengths and gold finger configurations.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If the preshrinking value is increased for longer PCBs, then the bonding expansion is compensated, but the PCB becomes too long during bonding causing edge positions to be affected and abnormal bonding

Engineering Contradiction:
Improvebonding accuracyVSAvoidbonding quality
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

The patent divides the PCB into multiple sections with different preshrinking values. Instead of applying a uniform preshrinking value across the entire PCB, the system calculates different preshrinking values for different sections based on their positions and dimensions. This segmentation allows each section to be optimized independently, preventing the PCB from being too long at edge positions while maintaining overall bonding accuracy.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent applies different preshrinking values to different sections of the PCB based on local requirements. The system calculates preshrinking values considering the specific dimensions, positions, and bonding requirements of each section, thereby optimizing bonding accuracy locally without compromising the overall PCB length or causing abnormal bonding at edges.

Inventive Principle:
Principle #3Local quality

2Ease of manufacture

If a uniform preshrinking value is applied across the entire PCB, then the calculation is simple, but the edge positions cannot be expanded properly resulting in abnormal bonding

Engineering Contradiction:
Improvedesign simplicityVSAvoidbonding accuracy
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent segments the PCB into multiple sections, each with its own preshrinking value calculated based on local dimensions and positioning requirements. This allows the system to maintain design simplicity through automated calculation while achieving precise bonding accuracy at each section, particularly at edge positions where expansion is critical.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent introduces dynamic preshrinking value calculation based on the actual dimensions and positions of different PCB sections. Instead of using a static uniform value, the system dynamically adjusts preshrinking values according to the specific requirements of each section, thereby optimizing bonding accuracy without significantly complicating the design process.

Inventive Principle:
Principle #15Dynamics

3Length of moving object

If the PCB length is increased to meet product requirements, then the display functionality is improved, but the preshrinking value increases causing the PCB to be too long during bonding

Engineering Contradiction:
ImprovePCB lengthVSAvoidbonding accuracy
Core Design Contradiction:
Length of moving objectVSManufacturing precision

Solution Approach 1:

The patent divides the long PCB into multiple sections with different preshrinking values. By segmenting the PCB, the system can maintain the overall required length for display functionality while applying optimized preshrinking values to each section, preventing the PCB from being too long during bonding and ensuring accurate edge positioning.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent changes the preshrinking parameter from a uniform value to variable values based on section-specific dimensions and positions. This parameter change allows the PCB to maintain its required length for functionality while adjusting the preshrinking values to prevent excessive length during bonding, thereby ensuring bonding accuracy.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method optimizes the preshrinking design length of PCBs, ensuring precise control over bonding accuracy and maintaining production yield while avoiding the need for special-shaped PCBs and preserving the PCB layout routing area.

Implementation Method 1

Since the bonding will expand when heated, so a certain preshrinking value will be considered when designing the PCB

Methodology Applied
Scientific EffectThermal expansion: Thermal Expansion

Data Source

PatentUS12079560B1Method of PCB sectional preshrinking, device, equipment and computer-readable storage medium
Publication Date: 2024.09.03 HKC CORP LTD
  • US12079560B1 patent drawing
  • US12079560B1 patent drawing
  • US12079560B1 patent drawing

AI summary

Disclosed are a method of PCB sectional preshrinking, a device, an equipment and a computer-readable storage medium. The method includes: obtaining a PCB raw data and a preset accuracy requirement; determining a preshrinking compensation value according to the PCB raw data and the preset accuracy requirement; determining a first sectional length according to the PCB raw data and the preshrinking compensation value; determining a preshrinking compensation ratio according to the preshrinking compensation value and the first sectional length; determining a second sectional length according to the PCB raw data, the first sectional length and the preshrinking compensation ratio; and determining an optimization preshrinking design length according to the first sectional length and the second sectional length.