PCB Security Shield Structure Against Probing and Tampering
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Solution Overview
Problem
Electronic circuit board assemblies in aerospace and industrial applications are vulnerable to cyber snooping and tampering due to numerous externally-accessible access points, which can be exploited by hackers to identify cybersecurity weaknesses.
Innovation Solution
Implementing a security layer on circuit boards that serves as a ground and electromagnetic shield, covering traces and electronic components, with features like ball grid array mounts and tamper covers to prevent physical and electromagnetic access, and using materials like glass fibre reinforced epoxy resin (FR4) for structural integrity and common thermal expansion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If coplanar layers of interconnecting traces and integrated test nodes are used on circuit board assemblies, then circuit operation assessment and manufacturing are simplified, but cybersecurity vulnerabilities increase due to externally-accessible access points
Solution Approach 1:
The patent extracts test nodes from external accessibility by embedding them within the security layer structure. Test nodes are moved from external surfaces where they could be probed to internal locations accessible only through controlled interfaces, removing the harmful external access points while preserving testing capability.
Solution Approach 2:
The security layer acts as an intermediary between the external environment and internal circuit traces. It provides controlled access points that allow necessary functions (testing, manufacturing) while blocking harmful external access. The security layer mediates between manufacturing simplicity and cybersecurity requirements.
2Ease of operation
If numerous externally-accessible access points are provided on circuit board assemblies, then testing and maintenance functions are improved, but susceptibility to electromagnetic probing and cyber snooping increases
Solution Approach 1:
The patent applies local quality by providing different access characteristics at different locations on the circuit board. Critical areas with sensitive traces have enhanced security features, while less sensitive areas maintain standard access. Test nodes are strategically positioned and protected with localized security measures rather than uniform protection across the entire board.
3Object-affected harmful factors
If a security layer is added to cover traces and electronic components, then cybersecurity protection is enhanced, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The security layer is designed to perform multiple functions simultaneously: it provides cybersecurity protection by blocking visual and electromagnetic access, maintains mechanical structural integrity of the circuit board, and incorporates test node access points for continued functionality. This multi-functionality reduces the need for separate components and minimizes overall device complexity.
Solution Approach 2:
The security layer utilizes composite material structures that combine electromagnetic shielding properties with mechanical strength requirements. By integrating multiple functions into a single composite layer rather than adding separate components, the patent enhances cybersecurity while controlling the increase in device complexity.
4Measurement precision
If test nodes are made accessible on outer surfaces via electrical connection, then circuit operation assessment is simplified, but physical access points for hacking are created
Solution Approach 1:
The patent implements nesting by placing test nodes within the security layer structure rather than on external surfaces. Test nodes are nested within protected areas, accessible only through controlled interfaces in the security layer. This nested arrangement allows precise circuit operation assessment while eliminating exposed physical access points that hackers could exploit.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The security layer effectively prevents visual and physical access to circuit traces and components, blocking electromagnetic radiation and tampering attempts, enhancing cybersecurity by making it difficult for hackers to identify vulnerabilities.
Implementation Method 1
the security layer forms at least one of a ground shield and an electromagnetic shield over the at least one trace plane
Data Source
AI summary
A circuit board assembly includes a first printed circuit board having at least one trace plane. The trace plane has a plurality of traces secured to a core material of the first printed circuit board. A security layer is included, where the security layer at least partially covers the at least one trace plane such that the security layer forms at least one of a ground shield and an electromagnetic shield over the at least one trace plane. In some implementations, the security layer is integral with a core material of the circuit board.