Printed Circuit Board With Segmented Wiring Layers For Fine Pitch Density
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Solution Overview
Problem
The increasing demand for higher density in printed circuit boards due to advancements in artificial intelligence and the rapid growth of CPU and GPU cores necessitates a reduction in circuit pattern pitch, while maintaining reliability and manufacturing efficiency.
Innovation Solution
A printed circuit board design featuring a first insulating layer with a groove portion, a first wiring layer with an embedded portion and a protruding portion, and a second wiring layer embedded below the first insulating layer, where the wiring density of the first wiring layer is greater than that of the second wiring layer, allowing for finer pitch wiring and improved reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the pitch of circuit patterns is reduced to increase density, then the wiring layer can accommodate more components and achieve higher integration, but the manufacturing precision requirements increase and reliability may deteriorate
Solution Approach 1:
The wiring layer is divided into multiple segments with different pitch requirements. The first wiring layer has a first pitch suitable for high-density integration, while the second wiring layer has a second pitch that is larger and easier to manufacture. This segmentation allows each layer to be optimized for its specific function, with the first layer providing high density and the second layer providing manufacturing ease.
Solution Approach 2:
Different regions of the circuit board have different wiring densities and pitch requirements. The first wiring layer is positioned in regions requiring high density, while the second wiring layer is positioned in regions requiring easier manufacturing. This local differentiation allows the board to achieve high overall density while maintaining manufacturing feasibility in critical areas.
2Quantity of substance
If the pitch of circuit patterns is reduced to increase density, then more components can be integrated, but the reliability of the circuit board may decrease due to increased complexity
Solution Approach 1:
The wiring structure is segmented into two distinct layers with different pitch characteristics. The first wiring layer with finer pitch handles high-density integration requirements, while the second wiring layer with coarser pitch provides structural stability and easier manufacturing. This segmentation distributes the reliability risks across different layers, preventing a single layer from bearing all the complexity.
Solution Approach 2:
Different regions of the circuit board are assigned different wiring layer configurations based on their specific requirements. High-density regions use the first wiring layer, while regions requiring stability use the second wiring layer. This local optimization ensures that reliability is maintained in critical areas while achieving high density where needed.
3Device complexity
If a single wiring layer is used to achieve high density, then the structure is simpler, but the manufacturing precision requirements become excessively high
Solution Approach 1:
The wiring structure is divided into two layers with different pitch characteristics. The first wiring layer uses a finer pitch for high-density applications, while the second wiring layer uses a coarser pitch that is easier to manufacture. This segmentation allows each layer to be manufactured within feasible precision limits while collectively achieving the desired high density.
Solution Approach 2:
The pitch parameter of the wiring layers is varied to optimize both density and manufacturability. The first wiring layer employs a smaller pitch value for high density, while the second wiring layer employs a larger pitch value for easier manufacturing. This parameter differentiation allows the system to achieve high overall density without requiring all wiring to be manufactured at extremely high precision.
Data Source
AI summary
The present disclosure relates to a printed circuit board and a manufacturing method of the printed circuit board. The printed circuit board includes: a first insulating layer including a groove portion on an upper side; and a first wiring layer having an embedded portion embedded in the groove portion and a protruding portion protruding onto the first insulating layer. The protruding portion of the first wiring layer has a width of a lower end portion, narrower than a width of an upper end portion.