PCB Thermal Dissipation via Selective Through-Hole Filling
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Solution Overview
Problem
Conventional printed circuit boards face limitations in current carrying capacity and thermal dissipation due to the thickness and structure of copper foil, and existing methods for producing multifunctional boards are costly and inefficient for complex conductor structures and heat dissipation.
Innovation Solution
The integration of selectively flat, thermally conductive elements on or within printed circuit boards connected via through-holes filled with highly conductive materials, allowing for efficient heat dissipation by friction or ultrasonic welding, enabling the attachment of heat dissipation surfaces at specific points or within the internal structure for improved thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional copper foil is used for conductor tracks, then the printed circuit board can be manufactured with standard etching technology, but the current carrying capacity and thermal dissipation capacity are limited by the copper foil thickness and structure width
Solution Approach 1:
The thermal management function is segmented from the conventional copper foil conductor tracks. Separate through-holes are created specifically for thermal dissipation, filled with thermally conductive material, and connected to heat-generating components. This separates the electrical conduction function (copper foil) from the thermal dissipation function (through-holes with conductive material), allowing each to be optimized independently.
Solution Approach 2:
The patent uses composite material structures: the printed circuit board combines conventional copper foil conductor tracks with through-holes filled with thermally conductive materials (such as metal powders, metal foils, or conductive polymers). This composite approach allows the board to simultaneously provide electrical conduction through copper and enhanced thermal dissipation through the filled through-holes, overcoming the limitations of single-material copper foil.
2Reliability
If through-holes are filled with thermally conductive materials to improve heat dissipation, then thermal dissipation capacity increases, but manufacturing complexity and cost increase
Solution Approach 1:
The through-holes are prepared and filled with thermally conductive materials during the printed circuit board manufacturing process, before the final assembly. The manufacturing method includes steps for creating through-holes, applying barriers, and filling with conductive materials as part of the board production sequence. This preliminary integration of thermal management features into the board manufacturing process reduces overall system complexity compared to adding thermal management components separately during assembly.
3Ease of manufacture
If conventional etching technology is used for producing printed circuit boards, then production processes are simple, but complex conductor structures and improved heat dissipation cannot be achieved
Solution Approach 1:
The manufacturing process is segmented into distinct stages: conventional etching for copper conductor tracks, separate through-hole creation, barrier layer application, and thermal conductive material filling. This segmentation allows the use of simple, well-established etching technology for electrical conduction while adding specialized processes for thermal management, thereby maintaining compatibility with conventional manufacturing while achieving enhanced functionality.
Solution Approach 2:
The printed circuit board is designed with multi-functionality: the same board structure simultaneously provides electrical conduction (via copper foil tracks), thermal dissipation (via filled through-holes), and mechanical support. The through-holes serve dual purposes as both structural features and thermal conduction pathways, allowing the board to handle complex conductor structures and heat dissipation requirements without requiring entirely new manufacturing technologies.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables cost-effective production of multifunctional printed circuit boards with enhanced heat dissipation capabilities, suitable for high-power components like LEDs, microprocessors, and thyristors, by effectively transporting heat generated by components to the rear of the assembly through thermally conductive through-holes.
Implementation Method 1
guided to the rear side for thermal conduction by means of selectively filled through holes with good thermal conductivity
Implementation Method 2
the functional element is connected as a relatively thick metal plate by friction welding on the copper surface of the printed circuit board
Implementation Method 3
fixed by friction welding or ultrasonic welding on the copper surface of the conductor track
Data Source
Figure 1~2
Figure 3~4
AI summary
The invention relates to a printed circuit board comprising additional functional elements and passage openings which are selectively filled with materials that have a good thermal conductivity and thus carry off the process heat produced by a component to the back of said board. The invention also relates to an inexpensive method for producing a printed circuit board comprising additional functional elements and selective passage openings of good thermal conductivity. The invention finally relates to the use of such a printed circuit board for carrying off the process heat produced by electrical or electronic components.