PCB-Embedded Semiconductor Package With Dual-Cavity Encapsulation
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Solution Overview
Problem
There is a need for more robust power semiconductors for chip embedding into a printed circuit board (PCB), as existing semiconductors lack adequate protection and handling challenges during chip embedding.
Innovation Solution
A semiconductor device is designed with a chip carrier featuring separate cavities for the semiconductor die and a contact pad, where an insulating layer and an electrical conductor are used to electrically couple the semiconductor die to the contact pad, and an encapsulant encapsulates the die and conductor for protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If semiconductor devices are provided without protective layer or encapsulation at contact pads for chip embedding, then chip embedding process is simplified, but handling of semiconductor device becomes complicated and device robustness decreases
Solution Approach 1:
The patent divides the chip carrier into separate cavities: one for mounting the semiconductor die and another for receiving the contact pad. This segmentation allows the contact pad to be separately positioned and connected to the semiconductor die through a conductor, simplifying the embedding process while maintaining proper device handling and protection.
2Device complexity
If semiconductor devices are provided without protective layer or encapsulation at contact pads, then chip embedding structure is simplified, but device reliability and protection decrease
Solution Approach 1:
The patent employs a nested structure where the contact pad is positioned within a cavity of the chip carrier, and the semiconductor die is mounted in a separate cavity. The electrical conductor connects these nested components, providing protection and reliability while maintaining a compact embedding structure.
3Device complexity
If contact pad is directly connected to semiconductor die without separate cavity and insulating layer, then device complexity is reduced, but electrical isolation and connection reliability worsen
Solution Approach 1:
The patent introduces an insulating layer as an intermediary between the contact pad and the semiconductor die. This insulating layer, combined with a conductor, provides precise electrical connection while maintaining proper isolation. The intermediary structures enable controlled and reliable electrical connections without direct contact between the pad and die.
Data Source
AI summary
A semiconductor device is disclosed. The semiconductor device includes a chip carrier having a first cavity and a second cavity. A semiconductor die is mounted in the first cavity. The semiconductor die includes a patterned top metallization layer having a first electrical contact pad. An insulating layer is arranged inside the second cavity. A first end of a first electrical conductor is arranged over the insulating layer and a second end of the first electrical conductor is arranged on the first electrical contact pad of the semiconductor die. An encapsulant encapsulates the semiconductor die, both ends of the first electrical conductor, and parts of the chip carrier. A method for manufacturing the semiconductor device is also disclosed.