Integrally Formed Sensor Dome Carrier on Printed Circuit Board
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Solution Overview
Problem
Existing printed circuit boards for motor vehicle electronic components require additional materials and separate leadframes for sensor domes, leading to increased production costs and complex electrical connections.
Innovation Solution
A printed circuit board with an integrally formed carrier body from the substrate, eliminating the need for separate materials and leadframes by using embedded conductor tracks for electrical contacting, and a method that cuts the carrier body from the substrate to create a cost-effective and simplified production process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate leadframes and sealing elements are used for sensor domes, then electrical connection and protection are achieved, but production costs and device complexity increase
Solution Approach 1:
The patent merges the carrier body with the printed circuit board substrate by forming the carrier body integrally from the substrate material itself. This eliminates the need for separate leadframes and sealing elements, as the substrate serves dual purposes: as the circuit board foundation and as the sensor dome carrier structure. The conductor tracks embedded in the substrate provide electrical connection directly to the sensor head mounted on the carrier body.
2Strength
If additional materials are used for sensor dome production, then structural requirements are met, but production costs increase
Solution Approach 1:
The substrate material serves multiple functions simultaneously: it provides the structural foundation of the printed circuit board, forms the carrier body for the sensor dome, provides electrical connection through embedded conductor tracks, and offers mechanical stability for mounting the sensor head. This multi-functionality eliminates the need for additional specialized materials for each function, reducing production costs.
3Ease of operation
If separate mounting of sensor dome is performed, then assembly flexibility is maintained, but production time and complexity increase
Solution Approach 1:
The carrier body is formed integrally with the substrate during the substrate manufacturing process itself, before the sensor head is mounted. This preliminary formation of the carrier body as part of the substrate eliminates subsequent separate mounting operations, reducing production steps and improving efficiency while maintaining the necessary structural and electrical connections.
Data Source
AI summary
The disclosure relates to a printed circuit board for an electronic component. The printed circuit board includes: an electrically insulating substrate; a number of electrically conductive conductor tracks; and at least one sensor dome having a sensor head and having a carrier body for accommodating the sensor head. The carrier body is formed integrally with the substrate. The disclosure also relates to a method for producing the printed circuit board.