PCB Sensor Thermal Bridge for Heat Sink Monitoring
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Solution Overview
Problem
Existing temperature monitoring systems for heat sources in electronic devices, such as power semiconductors, often fail to accurately determine temperature levels, leading to potential overheating and reduced control characteristics.
Innovation Solution
A multi-layer printed-circuit board with a sensor connected to a heat sink in a heat-conducting manner, using metallic areas with high thermal conductivity to ensure the sensor reaches the same temperature level as the heat sink, and a method to determine the temperature of the heat source by measuring the sensor's temperature rise with a correction factor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a sensor is connected to a heat sink in a heat-conducting manner using a printed-circuit board, then temperature monitoring accuracy is improved, but thermal conductivity between the sensor and heat sink deteriorates due to the insulating properties of the printed-circuit board substrate
Solution Approach 1:
The patent introduces metallic areas (copper traces, ground planes, or dedicated thermal vias) as intermediary elements within the printed-circuit board to facilitate thermal conduction. These metallic regions act as thermal bridges that conduct heat from the sensor through the insulating substrate to the heat sink, thereby improving temperature monitoring accuracy without relying on the substrate's poor thermal conductivity.
Solution Approach 2:
The printed-circuit board structure combines materials with different thermal properties: the substrate provides electrical insulation and mechanical support, while embedded metallic areas provide high thermal conductivity pathways. This composite approach allows the board to simultaneously fulfill electrical isolation requirements and thermal conduction requirements for accurate temperature monitoring.
2Measurement precision
If metallic areas are used to improve thermal conduction in the printed-circuit board, then temperature determination accuracy is improved, but electrical insulation between the sensor and heat sink may deteriorate
Solution Approach 1:
The patent applies different material properties to different regions of the printed-circuit board. Metallic areas with high thermal conductivity are strategically placed in regions where thermal conduction is needed (between sensor and heat sink), while the substrate material maintains its insulating properties in regions where electrical isolation is critical. This localized application of properties resolves the contradiction between thermal conduction and electrical insulation.
Solution Approach 2:
The thermal conduction path is segmented into distinct metallic regions that are electrically isolated from each other through the insulating substrate. This segmentation allows heat to conduct through the metallic areas while preventing unwanted electrical coupling between the sensor and heat sink, maintaining both thermal efficiency and electrical insulation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides accurate temperature monitoring, preventing overheating, improving control characteristics, and allowing for efficient heat dissipation while maintaining electrical insulation, thus enhancing safety and performance.
Implementation Method 1
the sensor being connected to the heat sink in a heat-conducting manner
Implementation Method 2
Metallic areas of the inner layers, which are provided in spatial proximity to the sensor, may be electrically connected to at least one metallic area at the surface facing the heat sink. A thermally well-conducting connection to the heat sink may be produced
Data Source
AI summary
A method for determining the temperature of a heat source and an electronic unit, including a printed-circuit board equipped with a sensor and a heat sink, the sensor being connected to the heat sink in a heat-conducting manner.