Stacked PCB Assembly with Embedded Separating Element for Compact Encapsulation

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Solution Overview

Problem

Existing printed circuit board assemblies face challenges in achieving a compact installation shape while allowing for systematic defect analysis, as conventional encapsulation methods make it difficult to reduce size and efficiently separate components for fault diagnosis.

Innovation Solution

Incorporating a separating element within the encapsulation between opposing printed circuit board regions, which can be fully embedded in the casting compound, allows for easy separation and access to components, reducing the amount of encapsulant needed and enabling a sealed encapsulation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If conventional encapsulation methods are used to protect electronic components, then protection against external effects is achieved, but the assembly size cannot be reduced and systematic defect analysis becomes difficult

Engineering Contradiction:

Improveprotection of electronic componentsVSAvoidassembly size

Core Design Contradiction:

Object-affected harmful factorsVSVolume of moving object

Solution Approach 1:

The printed circuit board is divided into multiple stacked boards (first PCB, second PCB, third PCB) that are separated by a separating element. This segmentation allows the encapsulation to be more compact while still providing protection, and enables systematic defect analysis by allowing access to specific board regions without removing the entire assembly.

Inventive Principle:

Principle #1Segmentation

2Object-affected harmful factors

If conventional encapsulation methods are used to protect electronic components, then protection against external effects is achieved, but systematic defect analysis becomes difficult

Engineering Contradiction:

Improveprotection of electronic componentsVSAvoidsystematic defect analysis

Core Design Contradiction:

Object-affected harmful factorsVSDifficulty of detecting and measuring

Solution Approach 1:

Inventive Principle:

Principle #1Segmentation

3Difficulty of detecting and measuring

If a separating element is embedded inside the encapsulation between printed circuit board regions, then clean separation for defect analysis is achieved, but the device complexity increases

Engineering Contradiction:

Improvedefect analysis capabilityVSAvoidencapsulation structure

Core Design Contradiction:

Difficulty of detecting and measuringVSDevice complexity

Solution Approach 1:

A separating element is introduced as an intermediary component between the stacked printed circuit boards. This separating element serves as a mediator that enables clean separation and access to specific board regions for defect analysis, while the encapsulation material seals around it to maintain protection. The separating element acts as a controlled interface that simplifies the overall complexity by providing a defined separation plane.

Inventive Principle:

Principle #24Intermediary (Mediator)

Data Source

PatentUS10856419B2Printed circuit board assembly

Publication Date: 2020.12.01 ZF FRIEDRICHSHAFEN AG

AI summary

A printed circuit board assembly (1) is provided that comprises a stacked or folded printed circuit board populated by components (2, 3), wherein printed circuit board regions (10, 11, 12) lying opposite one another are electrically connected to one another at least one edge, and wherein the printed circuit board and the components (2, 3) are encased in an encapsulation (4), and wherein at least one separating element (5) is located inside the encapsulation and between each pair of opposing and electrically connected printed circuit board regions (10, 11, 12).