Automated PCB Component Separation Verification

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Solution Overview

Problem

The existing methods for verifying the placement of chip components on printed circuit boards (PCBs) are time-consuming and prone to errors, leading to increased costs and redesigns due to the manual verification of separation distances, which can result in bridge bubbles and circuit malfunctions during conformal coating.

Innovation Solution

A method and apparatus using a computer program to obtain and check preset separation distance criteria for chip components, verifying whether the separation distances between alternately placed components satisfy the criteria, thereby automating the verification process to minimize bridge bubbles and ensure design quality.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If manual verification of separation distance is used, then design quality can be checked, but time consumption and error rate increase

Engineering Contradiction:
Improveseparation distance verification accuracyVSAvoidverification time
Core Design Contradiction:
Measurement precisionVSLoss of time

Solution Approach 1:

The patent replaces manual visual inspection with an automated image processing system that captures PCB component images and automatically calculates separation distances. The system uses computer vision algorithms to detect component positions and measure distances, eliminating the need for manual measurement and verification.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The system enables self-verification by automatically comparing measured separation distances against pre-stored standard values. The apparatus performs autonomous quality checking without requiring human intervention, generating verification results and warnings automatically when standards are not met.

Inventive Principle:
Principle #25Self-service

2Quantity of substance

If small spacing between components is used, then PCB density increases, but bridge bubbles occur during conformal coating

Engineering Contradiction:
Improvecomponent density on PCBVSAvoidconformal coating quality
Core Design Contradiction:
Quantity of substanceVSReliability

Solution Approach 1:

The system performs verification of separation distances during the design stage before manufacturing and conformal coating processes. By identifying potential bridge bubble risks early in the design phase, the system prevents quality issues before they occur, allowing for preventive design modifications.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The apparatus provides immediate feedback when separation distances fail to meet standards, warning designers of potential bridge bubble risks. This feedback mechanism enables real-time design optimization to balance component density with coating quality requirements.

Inventive Principle:
Principle #23Feedback

3Reliability

If large spacing between components is used, then bridge bubbles are prevented, but PCB area increases and density decreases

Engineering Contradiction:
Improveconformal coating qualityVSAvoidPCB area
Core Design Contradiction:
ReliabilityVSArea of stationary object

Solution Approach 1:

The system enables dynamic optimization of separation distance parameters based on specific design requirements. By providing precise measurement and comparison against standards, the system helps identify the minimum acceptable spacing that prevents bridge bubbles while minimizing PCB area consumption.

Inventive Principle:
Principle #35Parameter changes

4Productivity

If automated verification system is implemented, then verification speed increases, but device complexity increases

Engineering Contradiction:
Improveverification speedVSAvoidverification system complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The verification apparatus is designed to handle multiple component types and various separation distance standards through a unified image processing platform. The system can verify different PCB designs and component arrangements using the same core technology, reducing the need for multiple specialized tools.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentUS20240324161A1Method and apparatus for verifying placement of chip component on printed circuit board
Publication Date: 2024.09.26 SAMSUNG SDI CO LTD
  • US20240324161A1 patent drawing
  • US20240324161A1 patent drawing
  • US20240324161A1 patent drawing

AI summary

Provided is a method of verifying component placement on a printed circuit board (PCB), the method including obtaining a preset separation distance criterion for chip components designed to be mounted on the PCB, and based on the preset separation distance criterion for an arrangement of the chip components, checking whether a separation distance between the chip components satisfies the preset separation distance criterion, wherein the checking of whether the preset separation distance criterion is satisfied includes verifying, based on the preset separation distance criterion, whether the separation distance between the chip components that are placed to alternate with each other satisfies the preset separation distance criterion.