PCB Electromagnetic Shield Structure for ESD/EMI Suppression
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Solution Overview
Problem
In electronic devices, the limited space on printed circuit boards (PCBs) poses challenges for mounting components and wiring due to the need for electromagnetic shielding, which often requires additional space for effective noise suppression and ESD/EMI protection.
Innovation Solution
An electromagnetic shield structure is implemented on the PCB, featuring a cap with a sidewall extending non-parallel to the board surface, connected to both a side surface and top surface conductive structures, and electrically linked to the exterior housing, optimizing space usage by integrating shielding within the existing PCB layout.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a shield unit is added to suppress ESD/EMI, then electromagnetic shielding performance is improved, but PCB space for component mounting and wiring is reduced
Solution Approach 1:
The shield unit is integrated with the PCB structure by forming conductive structures directly on the PCB's side surface and top surface that connect to the shield unit. This merging of the shield unit with the PCB layout eliminates the need for separate shield structures, thereby suppressing ESD/EMI while preserving component mounting and wiring spaces on the PCB.
2Length of moving object
If the bezel is minimized to slim the device, then device thickness is reduced, but space for component mounting and wiring becomes more limited
Solution Approach 1:
The conductive structure extends from the side surface of the PCB to the top surface, utilizing the vertical dimension (Z-axis) to create an L-shaped configuration. This dimensional approach allows the shield structure to effectively suppress ESD/EMI coming from different directions without occupying additional horizontal space on the PCB, thereby maintaining device slimness while providing adequate shielding.
3Adaptability or versatility
If additional hardware is mounted on the PCB, then device functionality is enhanced, but available PCB space for other components and wiring is reduced
Solution Approach 1:
The conductive structures formed on the PCB serve multiple functions: they provide ESD/EMI shielding, act as grounding paths, and enable electrical connection to the shield unit. This multi-functionality allows the PCB to support additional hardware for enhanced device functionality while the same conductive structures provide necessary shielding, thereby avoiding the need for separate shielding components that would consume additional space.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively suppresses ESD/EMI while enhancing component mounting and wiring efficiency within the constrained PCB space, maintaining performance without reducing the device's thickness.
Implementation Method 1
a first conductive structure that is formed on a portion of the side surface of the PCB; and a second conductive structure that is formed on a portion of the first surface to be connected to the first conductive structure
Implementation Method 2
a shield structure including a cap that covers the electronic component and a sidewall extending from a periphery of the cap toward the first surface of the PCB
Data Source
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AI summary
An electronic device is provided that includes a printed circuit board (PCB) including a first surface, a second surface, and a side surface; an electronic component arranged on the first surface, adjacent to a portion of the side surface; a shield structure including a cap that covers the electronic component and a sidewall extending from a periphery of the cap toward the first surface of the PCB, wherein the sidewall extends in a first direction that is non-parallel to the first surface of the PCB; a first conductive structure that is formed on a portion of the side surface of the PCB; and a second conductive structure that is formed on a portion of the first surface to be connected to the first conductive structure. The sidewall contacts with the first surface of the PCB and overlaps with the second conductive structure, when viewed from above the first surface of the PCB.