PCB Shield Thermal Connector for Tolerance-Aware Heat Dissipation

Solution Overview

Problem

Existing heat dissipation solutions for electromagnetically shielded electronic components on printed circuit boards face challenges due to manufacturing tolerances, which hinder effective thermal conduction, especially when using thermal foam, resulting in poor heat dissipation.

Innovation Solution

A metal thermal connecting part is screwed into a protective layer, allowing for adjustable contact with the electronic component to enhance thermal conduction and adapt to manufacturing tolerances while maintaining electromagnetic shielding.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If thermal foam is used to accommodate manufacturing tolerances, then adaptability to manufacturing tolerances is improved, but heat dissipation efficiency deteriorates due to poor thermal conduction

Engineering Contradiction:

Improveadaptability to manufacturing tolerancesVSAvoidheat dissipation efficiency

Core Design Contradiction:

Adaptability or versatilityVSLoss of energy

Solution Approach 1:

The invention uses a composite structure combining metal material (for thermal conduction) and foam material (for adaptability and absorption of manufacturing tolerances). The metal ensures efficient heat transfer from the electronic component to the protective layer, while the foam allows the connection to accommodate height variations and positioning tolerances, thus resolving the contradiction between thermal performance and adaptability.

Inventive Principle:

Principle #40Composite materials

2Loss of energy

If a metal part of predetermined dimensions is used to make thermal connection, then heat dissipation efficiency is improved, but adaptability to manufacturing tolerances deteriorates

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidadaptability to manufacturing tolerances

Core Design Contradiction:

Loss of energyVSAdaptability or versatility

Solution Approach 1:

The invention uses a composite structure combining metal material (for thermal conduction) and foam material (for adaptability and absorption of manufacturing tolerances). The metal ensures efficient heat transfer from the electronic component to the protective layer, while the foam allows the connection to accommodate height variations and positioning tolerances, thus resolving the contradiction between thermal performance and adaptability.

Inventive Principle:

Principle #40Composite materials

3Ease of manufacture

If thermal foam is used between component and shielding, then ease of manufacture is improved by absorbing tolerances, but thermal conduction deteriorates

Engineering Contradiction:

Improveease of manufactureVSAvoidthermal conduction

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The invention uses a composite structure combining metal material (for thermal conduction) and foam material (for adaptability and absorption of manufacturing tolerances). The metal ensures efficient heat transfer from the electronic component to the protective layer, while the foam allows the connection to accommodate height variations and positioning tolerances, thus resolving the contradiction between thermal performance and adaptability.

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution provides improved heat dissipation efficiency by utilizing metal thermal connecting parts that can be adjusted to match component heights, ensuring effective thermal transfer without disrupting the protective shielding.

Implementation Method 1

a heat dissipation device for said electronic component, characterized in that said heat dissipation device comprises a metal thermal connecting part screwed into said protective layer, passing through said protective layer and coming into contact with said electronic component, so as to create a thermal connecting between said electronic component and said protective layer

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20240431017A1Electronic board equipped with a heat dissipation device and apparatus comprising such an electronic board

Publication Date: 2024.12.26 BULL SA

AI summary

The invention relates to an electronic board (200) comprising:a support (102),at least one electronic component (104) mounted on said support (102),a protective layer (110), mounted on said support (102), covering said electronic component (104) at a non-zero distance from said electronic component (104), anda heat dissipation device for said electronic component (104) comprising a metal thermal connecting part (202) screwed into said protective layer (110), passing through said protective layer (110) and coming into contact with said electronic component (104), so as to create a thermal connection between said electronic component (104) and said protective layer (110).It also relates to an electronic apparatus comprising such an electronic board.