PCB Shielding Structure With CNT Composite for Antenna EMI
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing circuit boards with integrated antennas and chips experience significant signal interference due to electromagnetic interactions, which are inadequately shielded by air cavities, leading to limited signal transmission and warping issues during manufacturing.
Innovation Solution
A circuit board assembly featuring a shielding structure composed of carbon nanotubes, metal, and resin, with a metal film and cover, is used to overlap with an antenna, shielding signal interference and enhancing transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If air cavities are manufactured in the circuit board to shield signal interference, then signal shielding is improved, but manufacturing precision requirements increase and board warping occurs
Solution Approach 1:
The patent uses composite shielding material comprising conductive particles (such as metal powder or carbon particles) dispersed in a resin matrix to form the shielding structure. This composite material provides effective electromagnetic shielding while being manufacturable through conventional PCB processes without requiring precise alignment, thus resolving the contradiction between shielding effectiveness and manufacturing precision requirements
2Object-affected harmful factors
If air cavities are manufactured in the circuit board to shield signal interference, then signal shielding is improved, but the circuit board experiences warping
Solution Approach 1:
The resin-based composite shielding material maintains the structural integrity and flatness of the circuit board while providing electromagnetic shielding. Unlike air cavities that create voids and potential warping, the composite material fills the shielding region uniformly, maintaining board stability and preventing warping during manufacturing and operation
3Object-affected harmful factors
If traditional shielding methods are used to block electromagnetic interference, then signal transmission is improved, but the device complexity increases
Solution Approach 1:
The shielding structure is integrated directly into the circuit board as an inherent component rather than a separate added element. The conductive particles embedded in the resin form the shielding function within the board's existing structure, merging the shielding function with the board itself and avoiding additional complex shielding components or assemblies
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The shielding structure effectively reduces electromagnetic interference, improving signal transmission and preventing warping by reflecting and absorbing electromagnetic waves, while maintaining manufacturing ease.
Implementation Method 1
the shielding structure shields the signal interference between an antenna and a chip, thereby enhancing the signal transmission of the antenna... the shielding structure effectively reduces electromagnetic interference, improving signal transmission and preventing warping by reflecting and absorbing electromagnetic waves
Implementation Method 2
A material of the shielding structure includes carbon nanotube, metal and resin while the carbon nanotube and the metal are distributed in the resin
Data Source
AI summary
A circuit board assembly and a fabricating method of the same are provided. The circuit board assembly includes a wiring board and a shielding structure. The wiring board includes a dielectric layer, a wiring layer, a metal film and a metal cover. The first wiring layer includes an antenna. The shielding structure is disposed in the wiring board. The metal film covers a part of the shielding structure, and the metal cover touches the metal film and covers another part of the shielding structure not covered by the metal film. The dielectric layer and the wiring layer are in stacks while the dielectric layer is located on one side of the shielding structure. A material of the shielding structure includes carbon nanotube, metal and resin while the carbon nanotube and the metal are distributed in the resin.