Integrated Shielding Dam for PCB EMI Reduction

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Solution Overview

Problem

Existing EMI shielding structures for printed circuit boards face challenges in minimizing space for circuit devices due to intervals between adjacent shielding regions, leading to reduced integration rates and increased production costs.

Innovation Solution

An EMI shielding structure that omits intervals between adjacent shielding regions by forming a continuous shielding dam with electroconductive material, including a border and partition portions, and uses an insulating member to cover circuit devices, allowing for increased mounting space and reduced material usage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If separate shield cans are used for adjacent shielding regions, then EMI shielding effectiveness is improved, but mounting space is reduced due to required intervals between shield cans

Engineering Contradiction:
ImproveEMI shielding effectivenessVSAvoidmounting space
Core Design Contradiction:
ReliabilityVSArea of stationary object

Solution Approach 1:

The patent merges multiple separate shield cans into a single integrated shielding structure that covers multiple adjacent shielding regions. The shielding structure includes a continuous shielding wall with internal partitions that create separate shielding spaces, eliminating the need for intervals between individual shield cans while maintaining EMI shielding effectiveness for each region.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The shielding structure is segmented into multiple shielding regions through internal partitions within the continuous shielding wall. Each partition creates a separate shielding space for individual circuit devices, maintaining the EMI shielding function for each region while allowing the overall structure to be mounted without intervals.

Inventive Principle:
Principle #1Segmentation

2Reliability

If separate shield cans are used for each shielding region, then EMI shielding is achieved, but manufacturing complexity and cost increase due to separate press processes

Engineering Contradiction:
ImproveEMI shieldingVSAvoidmanufacturing process complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines multiple shield can manufacturing operations into a single integrated manufacturing process. The shielding structure is formed as one piece or pre-assembled unit, eliminating the need for separate press processes for each shield can and reducing manufacturing complexity and costs.

Inventive Principle:
Principle #5Merging (Combining)

3Stability of the object's composition

If intervals are reserved between adjacent shield cans, then proper fixation is ensured, but the mounting region of the printed circuit board decreases

Engineering Contradiction:
Improveshield can fixationVSAvoidmounting region
Core Design Contradiction:
Stability of the object's compositionVSArea of stationary object

Solution Approach 1:

The patent merges multiple fixation requirements into a single fixation system. The integrated shielding structure can be fixed to the printed circuit board at fewer locations while maintaining stability, as the continuous shielding wall provides structural rigidity that eliminates the need for multiple separate fixation points required by individual shield cans.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enhances the integration rate of circuit devices on printed circuit boards by maximizing mounting space and minimizing material consumption and processing time, while maintaining effective EMI shielding.

Implementation Method 1

a shielding dam provided on a printed circuit board, the shielding dam forming a closed loop that defines a periphery of adjacent shielding regions

Methodology Applied
Scientific EffectElectromagnetic shielding: Faraday Cage

Data Source

PatentUS10477687B2Manufacturing method for EMI shielding structure
Publication Date: 2019.11.12 SAMSUNG ELECTRONICS CO LTD
  • US10477687B2 patent drawing
  • US10477687B2 patent drawing
  • US10477687B2 patent drawing

AI summary

An electromagnetic interference (EMI) shielding structure and a manufacturing method thereof are provided. The EMI shielding structure includes a shielding dam provided on a printed circuit board, the shielding dam forming a closed loop that defines a periphery of adjacent shielding regions of the printed circuit board; an insulating member that is provided on the adjacent shielding regions within the shielding dam, the insulating member covering circuit devices provided in the adjacent shielding regions; and a shielding member that covers an upper surface of the insulating member, wherein the shielding dam includes a border portion surrounding the adjacent shielding regions, and a partition portion disposed between the adjacent shielding regions and within the border portion.