PCB Shielding Structure for Dense Wiring and Low Signal Interference
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Solution Overview
Problem
The increasing demand for multi-chip packages with high wiring density on substrates leads to signal interference due to closer pattern distances, which existing methods struggle to adequately address.
Innovation Solution
A printed circuit board design that includes a first insulating layer with spaced wiring patterns, covered by an insulating film and a metal layer, and further surrounded by a second insulating layer and metal layer, effectively reducing signal interference while maintaining close wiring distances.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If wiring patterns are placed closer together to increase wiring density, then productivity and area utilization improve, but signal interference increases
Solution Approach 1:
A metal layer is introduced as an intermediary element between adjacent wiring patterns. This metal layer acts as a shield that blocks electromagnetic interference between closely spaced wiring patterns, enabling high wiring density without sacrificing signal quality. The metal layer is positioned between the wiring patterns and connected to a reference potential to effectively ground the interference.
Solution Approach 2:
The solution moves from a two-dimensional planar arrangement to a three-dimensional structure by adding vertical layering. Multiple insulating layers and metal layers are stacked to create vertical separation and shielding, allowing wiring patterns to be placed closer horizontally while maintaining signal integrity through vertical shielding structures.
2Manufacturing precision
If insulating films are formed conformally on wiring patterns to reduce interference, then manufacturing precision improves, but device complexity increases
Solution Approach 1:
The metal layer serves multiple functions simultaneously: it acts as a shield against electromagnetic interference, provides a reference potential for signal stabilization, and serves as an electrical connection path. This multi-functionality reduces the need for additional separate structures, thereby limiting the increase in device complexity.
Solution Approach 2:
The structure employs nested layering where insulating layers are positioned between wiring patterns and metal layers, which are in turn positioned between insulating layers. This nested arrangement creates an integrated multi-layer structure where each layer contributes to both insulation and shielding functions, managing complexity through systematic organization.
Data Source
AI summary
The present disclosure relates to a printed circuit board, the printed circuit including: a first insulating layer; a plurality of first wiring patterns disposed to be spaced apart from each other on the first insulating layer; a first insulating film disposed on the first insulating layer, and covering each of the plurality of first wiring patterns along a surface of each of the plurality of first wiring patterns; a first metal layer covering the first insulating film along a surface of the first insulating film; and a second insulating layer covering the first metal layer, and disposed in at least a portion of spaces between the plurality of first wiring patterns that are spaced apart from each other.