PCB Shielding Structure With Stepped Ground Contact for Heat Dissipation

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Solution Overview

Problem

Existing electronic devices in vehicles face challenges in improving heat dissipation efficiency while maintaining a lightweight design.

Innovation Solution

The electronic device incorporates a housing made of polymer resin with a shielding member and ground member integrated by insert injection, featuring regions with height differences for enhanced heat dissipation and electrical noise prevention.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If metal shielding members and ground members are integrated with polymer resin housing by insert injection, then electrical noise prevention and grounding are improved, but manufacturing complexity increases

Engineering Contradiction:
Improveelectrical noise preventionVSAvoidmanufacturing process complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines multiple components (housing, shielding member, and ground member) into a single integrated structure through insert injection molding. The metal shielding member and ground member are embedded directly into the polymer resin housing during the molding process, creating a unified assembly that prevents electrical noise and ensures proper grounding while reducing the number of separate parts and assembly steps.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The shielding member and ground member are prepared in advance as pre-formed metal components with specific geometries and electrical connection features. These pre-prepared components are then inserted into the housing mold before the polymer resin is injected, allowing the grounding and shielding functions to be established during the molding process itself rather than requiring subsequent assembly operations.

Inventive Principle:
Principle #10Preliminary action

2Device complexity

If shielding member and ground member are integrated by insert injection, then grounding structure is simplified, but manufacturing precision requirements increase

Engineering Contradiction:
Improvegrounding structure complexityVSAvoidinsert injection precision
Core Design Contradiction:
Device complexityVSManufacturing precision

Solution Approach 1:

The patent applies different material properties and structural characteristics to different regions of the housing. The shielding member and ground member are integrated at specific locations where electrical noise prevention and grounding are most critical, while other portions of the housing maintain their standard polymer resin construction. This localized integration approach simplifies the grounding structure at key interfaces without requiring precision integration throughout the entire housing.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The insert injection process is designed so that the metal shielding member and ground member serve multiple functions simultaneously: they provide electrical shielding, establish grounding paths, and act as structural reinforcement at critical interfaces. The integration process itself creates the electrical connections through direct metal-to-polymer contact, eliminating the need for separate grounding wires or additional connection hardware.

Inventive Principle:
Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances heat dissipation efficiency and reduces electrical noise, ensuring effective grounding and weight reduction.

Implementation Method 1

a shielding member disposed in the receiving part and configured to shield at least a portion of the printed circuit board

Methodology Applied
Scientific EffectElectromagnetic shielding: Faraday Cage

Implementation Method 2

The shielding member may be made of a metal material and be integrated with the housing by insert injection

Methodology Applied
Scientific EffectInsert injection molding:

Data Source

PatentEP4608083A1Electronic device
Publication Date: 2025.08.27 LG INNOTEK CO LTD
  • EP4608083A1 patent drawingFigure 1
  • EP4608083A1 patent drawingFigure 2
  • EP4608083A1 patent drawingFigure 3

AI summary

This electronic device comprises: a housing having a receiving part formed therein and comprising a polymer resin; a printed circuit board disposed in the receiving part; a connector connected to the printed circuit board; and a shielding member disposed in the receiving part and covering at least a portion of the printed circuit board, wherein the shielding member includes a first region and a second region disposed to have a level difference in the vertical direction with respect to the first region, and the connector includes a ground pin that is in contact with the second region.