PCB Shielding Layer Coverage via Inclined Insulating Layer
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing methods for manufacturing printed circuit boards with electromagnetic wave shielding layers suffer from inadequate coverage and poor electromagnetic wave shielding characteristics, particularly when using ink jet printing techniques.
Innovation Solution
A manufacturing method that forms a printed circuit board with a ground wiring line, a semiconductor device embedded in an insulating layer with an inclined part, and an electromagnetic wave shielding layer. The method involves gradually reducing the outer edge of the jetting region of insulating ink to create an inclined part on the insulating layer, which improves the adhesion and coverage of the conductive ink for the shielding layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If an insulating layer and electromagnetic wave shielding layer are laminated to form an electromagnetic wave shield on a printed wiring board, then electromagnetic interference is reduced, but the coverage and electromagnetic wave shielding characteristics are deteriorated
Solution Approach 1:
The patent applies preliminary action by forming an inclined part on the insulating layer before depositing the electromagnetic wave shielding layer. This inclined structure is created in advance to improve the adhesion and coverage of the subsequent shielding layer, ensuring better electromagnetic wave shielding characteristics while maintaining the electromagnetic interference reduction function
Solution Approach 2:
The patent utilizes curvature by creating an inclined part (curved surface) on the insulating layer instead of a flat surface. This curved structure enhances the coverage area and adhesion of the electromagnetic wave shielding layer, improving the overall shielding characteristics while maintaining the electromagnetic interference protection function
2Object-affected harmful factors
If a shielding can is used to shield a semiconductor device from electromagnetic waves, then electromagnetic interference is prevented, but the device becomes thick and heavy with limited design freedom
Solution Approach 1:
The patent extracts the essential shielding function from the traditional shielding can structure and implements it through laminated insulating and electromagnetic wave shielding layers directly on the printed wiring board. This extraction eliminates the need for separate shielding cans, reducing thickness and weight while maintaining electromagnetic interference protection
Solution Approach 2:
The patent uses thin film structures (laminated insulating layer and electromagnetic wave shielding layer) instead of rigid shielding cans. This approach provides flexible design freedom while achieving the same electromagnetic interference protection, significantly reducing thickness and weight compared to traditional shielding can solutions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method achieves excellent coverage and enhanced electromagnetic wave shielding characteristics by ensuring better adhesion and uniformity of the shielding layer, reducing surface defects and improving the overall shielding performance.
Implementation Method 1
a step of forming, on the printed wiring board on which the semiconductor device is mounted, a layer by gradually reducing an outer edge of a jetting region of an insulating ink such that the inclined part is formed to form the insulating layer having the inclined part, in a case where the layer is laminated by performing a step of forming the layer by jetting the insulating ink with an ink jet a plurality of times
Implementation Method 2
a step of forming, on the insulating layer, the electromagnetic wave shielding layer by jetting a conductive ink with an ink jet
Data Source
AI summary
Provided is a manufacturing method of a printed circuit board, which has excellent coverage of an electromagnetic wave shielding layer and excellent electromagnetic wave shielding characteristics. A manufacturing method of a printed circuit board that includes a printed wiring board having a ground wiring line, at least one semiconductor device mounted in a region surrounded by the ground wiring line on the printed wiring board, an insulating layer that embeds at least one of the semiconductor device, is disposed inside the ground wiring line, and has an inclined part at an outer edge, and an electromagnetic wave shielding layer disposed on the insulating layer, the method includes a step of forming, on the printed wiring board on which the semiconductor device is mounted, a layer by gradually reducing an outer edge of a jetting region of an insulating ink from a printed wiring board side such that the inclined part is formed to form the insulating layer having the inclined part, in a case where the layer is laminated by performing a step of forming the layer by jetting the insulating ink with an ink jet a plurality of times; and a step of forming, on the insulating layer, the electromagnetic wave shielding layer by jetting a conductive ink with an ink jet.