Multilayer PCB Shielding Device for EMI Protection
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Solution Overview
Problem
Existing shielding devices for electronic components on printed circuit boards, such as transformers in implants, fail to provide adequate electromagnetic interference (EMI) protection due to design limitations, including cutouts that allow external magnetic fields to interfere with the components, leading to reduced efficiency and potential failure.
Innovation Solution
A shielding device comprising a top and bottom shielding component, where the bottom shielding is integrated into the printed circuit board and features a multilayered electrically and magnetically conductive metal sheet layer with insulating layers, providing complete coverage and reducing the intrusion area for magnetic flux, and the top shielding is electrically isolated from the component, allowing for effective EMI protection without grounding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a shielding cap with cutouts is used to accommodate attachment pins, then the attachment pins can pass through, but the EMI protection is insufficient due to gaps in the shielding
Solution Approach 1:
The shielding device is divided into a top shielding part and a bottom shielding part that are separable and can be assembled around the electronic component. This segmentation allows the attachment pins to pass through the bottom shielding while the top shielding provides continuous EMI protection without requiring cutouts.
Solution Approach 2:
The shielding protection is extended from a single-layer cap to a multi-layer structure with top and bottom shielding parts. This dimensional approach allows the attachment pins to pass through the bottom layer while the top layer maintains continuous shielding coverage.
2Object-affected harmful factors
If a shielding device is fixed to the electronic component, then EMI protection is provided, but the mechanical robustness is constrained
Solution Approach 1:
The shielding device is segmented into top and bottom parts that can be independently positioned. The bottom shielding part is fixed to the printed circuit board while the top shielding part is positioned above the component, distributing mechanical stresses and avoiding constraint of the component's mechanical robustness.
3Ease of operation
If attachment pins are used to mount the component, then electrical connection is established, but complete shielding is not possible due to the pins creating gaps
Solution Approach 1:
The shielding solution moves from a single-plane cap to a three-dimensional structure with top and bottom shielding parts. The attachment pins pass through the bottom shielding layer while the top shielding layer maintains continuous coverage, achieving complete shielding despite the presence of electrical connection pins.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively shields electronic components from external magnetic fields, ensuring operational efficiency and mechanical robustness by completely enveloping the component and reducing the area where conductive material is absent, thus preventing magnetic flux intrusion and enhancing attachment strength.
Implementation Method 1
a bottom shielding integrated into the printed circuit board exhibiting a multilayered electrically and magnetically conductive metal sheet layer
Implementation Method 2
comprising at least two electrically conductive transmission lines for conducting electric current to the electronic component
Data Source
AI summary
A shielding device for shielding an electronic component (102) to be mounted on a printed circuit board (132). The shielding device exhibiting a top shielding (110) and a bottom shielding (120; 140; 160; 180) separable from each other, wherein the top shielding includes an electrically and/or magnetically conductive material and the bottom shielding is multilayered. The bottom shielding exhibits at least one electrically and/or magnetically conductive metal sheet layer (122; 162; 164) embedded between at least two insulating layers (126; 124) and includes at least two electrically conductive transmission lines (172; 174; 176) for conducting electric current to the electronic component. The top shielding and the conductive metal sheet layer are electrically isolated from the electronic component. The bottom shielding integrated into the printed circuit board and the top shielding and the bottom shielding designed such when they are attached to each other, they completely envelope the electronic component.