PCB Shielding Pad Layout for Denser Circuit Board Assemblies

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Solution Overview

Problem

The limited spacing between shielding cases on circuit boards leads to wasted space, preventing high-density component layout due to the 0.25 mm minimum distance constraint, which hinders miniaturization and ultra-thin development.

Innovation Solution

The integration of first and second pads as integral structural members, connected via a connection portion, allows for reduced spacing between adjacent pads, enabling a larger component density on the circuit board by reducing the layout area of shielding cases.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the minimum spacing of 0.25 mm between shielding cases is maintained, then the connection strength and manufacturing reliability are ensured, but the circuit board area is wasted and component density is reduced

Engineering Contradiction:

Improveconnection strength between shielding case and padVSAvoidcircuit board layout area

Core Design Contradiction:

ReliabilityVSArea of stationary object

Solution Approach 1:

The patent merges two adjacent pads (first pad for first shielding case and second pad for second shielding case) into a single integral pad structure. This integration eliminates the 0.25 mm spacing requirement between separate pads, allowing the shielding cases to be positioned closer together on the circuit board, thereby reducing the overall layout area while maintaining reliable solder connections through the unified pad structure.

Inventive Principle:

Principle #5Merging (Combining)

2Area of stationary object

If the spacing between adjacent pads is reduced, then the circuit board area is reduced and component density is increased, but the connection strength may be compromised

Engineering Contradiction:

Improvecircuit board layout areaVSAvoidconnection strength between pad and shielding case

Core Design Contradiction:

Area of stationary objectVSStrength

Solution Approach 1:

By integrating two pads into one integral structure, the connection area for each shielding case is effectively increased and optimized. The unified pad provides sufficient soldering area and structural support, ensuring strong mechanical and electrical connections between the shielding cases and the circuit board, even when the overall spacing between shielding cases is reduced.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The integral pad structure extends in multiple dimensions to provide adequate soldering surface area. By optimizing the pad's shape and size in the planar dimension while integrating it with the adjacent pad region, the design maintains sufficient connection strength without requiring increased spacing between shielding cases.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Productivity

If more electronic components are mounted per unit area, then the circuit board area utilization is improved, but the processing and manufacturing complexity increases

Engineering Contradiction:

Improvecomponent density on circuit boardVSAvoidprocessing capability limit

Core Design Contradiction:

ProductivityVSEase of manufacture

Solution Approach 1:

The integration of adjacent pads into a single integral structure simplifies the manufacturing process by reducing the number of discrete pad features that need to be processed. This approach allows for higher component density without proportionally increasing manufacturing complexity, as the integral pad can be fabricated using standard PCB processes without requiring additional complex steps for each individual pad.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration facilitates miniaturization and ultra-thin development by allowing more components per unit area or the same number of components on a smaller circuit board, enhancing connection strength and stability through optimized solder distribution and reduced pad area.

Implementation Method 1

some solder may be accumulated on a side edge that is of a first flange portion and that is close to the connection portion

Methodology Applied

Scientific EffectGravity: Gravitation

Implementation Method 2

The accumulated solder on the first flange portion helps improve connection strength between the first sidewall and the first pad

Methodology Applied

Scientific EffectSurface tension: Surface Tension

Data Source

PatentUS20260020143A1Circuit board, circuit board assembly, and electronic device

Publication Date: 2026.01.15 HONOR DEVICE CO LTD

AI summary

This application provides a circuit board, a circuit board assembly, and an electronic device. Specifically, the circuit board includes a circuit board body, a first group of pads, and a second group of pads. The circuit board body includes a first surface. The first group of pads and the second group of pads are disposed on the first surface. The first group of pads is distributed along a first ring, the first group of pads includes first pads, and the first pads are arranged on an edge that is of the first ring and that is close to the second group of pads. The second group of pads is distributed along a second ring, the second group of pads includes second pads, and the second pads are arranged on an edge that is of the second ring and that is close to the first group of pads.