PCB Heat-Dissipation Shielding Structure for EMI and Thermal Balance
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Solution Overview
Problem
The accumulation of heat within shielding covers on printed circuit boards due to limited air flow and poor heat dissipation affects the performance and service life of electronic components, particularly active components, which generate more heat.
Innovation Solution
A heat dissipation shielding structure comprising an insulating layer and a shielding layer that undulate with the contours of electronic components, enhancing heat transfer and conduction efficiency, and optionally incorporating thermal conductive structures and graphite layers for improved heat exchange.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a shielding cover is used to shield electronic components, then electromagnetic interference is prevented, but heat dissipation deteriorates
Solution Approach 1:
The patent divides the shielding cover into multiple segmented structures with heat dissipation openings, allowing electromagnetic shielding while enabling heat to escape through the openings. The segmentation creates pathways for heat dissipation without compromising the overall shielding effectiveness.
Solution Approach 2:
The patent introduces heat dissipation openings as intermediary structures that mediate between the shielding requirement and heat dissipation need. These openings allow heat to pass through while the surrounding shielding material maintains electromagnetic protection.
2Temperature
If heat dissipation openings are added to the shielding cover, then heat dissipation is improved, but shielding effectiveness deteriorates
Solution Approach 1:
The patent applies local quality by making the shielding cover non-uniform, with specific regions having heat dissipation openings while other regions maintain continuous shielding. This localized modification allows heat dissipation in critical areas while preserving shielding effectiveness in other areas.
Solution Approach 2:
The patent uses composite structures combining shielding material with heat dissipation features, creating a composite component that simultaneously provides electromagnetic shielding and thermal management functions.
3Reliability
If the shielding cover is made airtight, then environmental protection is improved, but air flow and heat dissipation deteriorate
Solution Approach 1:
The patent segments the airtight structure by introducing controlled openings for heat dissipation, creating a balance between environmental protection and air flow requirements.
Solution Approach 2:
The patent employs flexible sealing structures around the heat dissipation openings that can adapt to maintain environmental protection while allowing controlled air flow for heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The structure effectively dissipates heat from both active and passive components, improving operating stability and safety by ensuring uniform heat transfer and reducing the risk of over-temperature faults.
Implementation Method 1
because a thermal conductivity of the insulating layer is greater than a thermal conductivity of air, the insulating layer is disposed between the shielding layer and the electronic components, to implement insulative isolation for the electronic components, and improve heat conduction efficiency between the electronic components and the shielding layer
Implementation Method 2
a shielding layer, where the shielding layer is covered on the first surface, a shape of the shielding layer matches a shape of the first surface, and the shielding layer is electrically connected to a ground network of the printed circuit board
Data Source
AI summary
This application relates to a heat dissipation shielding structure and a processing method, a circuit board assembly, and an electronic device. The printed circuit board includes a mounting surface. Electronic components are mounted on the mounting surface. The electronic components include an active component and a passive component. The heat dissipation shielding structure includes an insulating layer. The insulating layer is covered on the mounting surface, and wraps at least a side surface of the active component, so that a side that is of the insulating layer and that faces away from the mounting surface forms a first surface together with a top surface of the active component. A shielding layer is covered on the first surface, a shape of the shielding layer matches a shape of the first surface, and the shielding layer is electrically connected to a ground network of the printed circuit board.