PCB Heat-Dissipation Shielding Structure for EMI and Thermal Control
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Solution Overview
Problem
The accumulation of heat within shielding covers on printed circuit boards due to limited air flow and heat dissipation paths affects the performance and service life of electronic components, particularly active components, which generate more heat.
Innovation Solution
A heat dissipation shielding structure is implemented with an insulating layer wrapping the electronic components and a shielding layer that matches the undulating contours of the components, enhancing heat transfer and conduction efficiency, and includes features like thermal conductive structures and graphite layers to improve heat exchange.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a shielding cover is added to shield electronic components, then electromagnetic interference is reduced, but heat dissipation performance deteriorates
Solution Approach 1:
The patent employs a flexible shielding layer that conformally wraps around electronic components with varying heights. This flexible film structure maintains effective electromagnetic shielding coverage while incorporating heat dissipation holes that allow thermal management, resolving the contradiction between shielding effectiveness and heat dissipation performance
Solution Approach 2:
The patent introduces a heat dissipation structure as an intermediary element between the shielding layer and electronic components. This intermediary structure with heat dissipation holes facilitates thermal exchange while the shielding layer provides electromagnetic protection, allowing both shielding and heat dissipation functions to coexist
2Ease of manufacture
If the shielding layer is made flat, then manufacturing is simplified, but heat transfer efficiency deteriorates
Solution Approach 1:
The patent applies curvature to the shielding layer by making it conformally wrap around electronic components of different heights. This curved, undulating shielding layer structure optimizes heat transfer pathways and improves thermal contact with components while maintaining manufacturing feasibility through flexible material properties
3Reliability
If the insulating layer thickness is increased, then insulation performance is improved, but heat conduction efficiency deteriorates
Solution Approach 1:
The patent applies local quality by creating variable thickness regions in the insulating layer. The insulating layer has different thicknesses at different locations - thinner regions where heat conduction is critical and thicker regions where insulation is prioritized - thus locally optimizing both insulation performance and heat conduction efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The structure effectively dissipates heat from both active and passive components, improving operating stability and safety by ensuring efficient heat transfer and reducing temperature-related faults.
Implementation Method 1
because a thermal conductivity of the insulating layer is greater than a thermal conductivity of air, the insulating layer is disposed between the shielding layer and the electronic components, to implement insulative isolation for the electronic components, and improve heat conduction efficiency between the electronic components and the shielding layer
Implementation Method 2
a shielding layer, where the shielding layer is covered on the first surface, a shape of the shielding layer matches a shape of the first surface, and the shielding layer is electrically connected to a ground network of the printed circuit board
Data Source
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AI summary
This application relates to heat dissipation structures, and in particular, to a heat dissipation shielding structure and a processing method, a circuit board assembly, and an electronic device. The heat dissipation shielding structure is used in a printed circuit board. The printed circuit board includes a mounting surface. Electronic components are mounted on the mounting surface. The electronic components include an active component and a passive component. The heat dissipation shielding structure includes an insulating layer. The insulating layer is covered on the mounting surface, wraps a side surface and a top surface of the passive component, and wraps at least a side surface of the active component, so that a side that is of the insulating layer and that faces away from the mounting surface forms a first surface or a side that is of the insulating layer and that faces away from the mounting surface forms a first surface together with a top surface of the active component. A shielding layer is covered on the first surface, a shape of the shielding layer matches a shape of the first surface, and the shielding layer is electrically connected to a ground network of the printed circuit board. The heat dissipation shielding structure provided in this application can implement a shielding effect on the electronic components on the printed circuit board and can further improve a heat dissipation effect on the electronic components, thereby improving operating stability and safety of the printed circuit board.