PCB Side-Edge Component Layout for Compact EMI-Reliable Boards
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Solution Overview
Problem
The challenge is to reduce the size of printed circuit boards (PCBs) while maintaining power density and reliability, particularly during electromagnetic interference (EMI)/electromagnetic compatibility (EMC) testing, and to minimize manufacturing and assembly costs and time.
Innovation Solution
The solution involves mounting daughter circuit board components and surface mount device (SMD) components on the side edges of the PCB instead of the top and bottom surfaces, allowing for a reduction in PCB size while maintaining component accessibility and reliability. This configuration also eliminates the need for a separate daughter circuit board, freeing up space for other components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the size of the PCB is reduced to save space and reduce manufacturing cost, then the manufacturing cost and time are reduced, but the power density of the PCB deteriorates
Solution Approach 1:
The patent transitions from traditional top/bottom surface mounting to side edge mounting of components. By utilizing the vertical side edges of the PCB as mounting surfaces, the design effectively adds a dimensional aspect for component placement, allowing high power density components to be positioned on the edges while maintaining a compact overall footprint.
2Area of stationary object
If components are arranged to reduce PCB size, then the space utilization is improved, but the reliability during EMC/EMI testing deteriorates
Solution Approach 1:
The patent segments the PCB into distinct functional zones: side edges are dedicated to high-frequency/power components requiring EMI shielding, while top and bottom surfaces are used for low-frequency signal components. This spatial segmentation isolates EMI-sensitive areas from EMI-generating areas, maintaining reliability while achieving compact size.
Data Source
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AI summary
A printed circuit board includes a first surface opposite a second surface. The printed circuit board also includes at least one daughter circuit board component mounted on a first side edge of a plurality of side edges defined by the first surface and the second surface. The printed circuit board also includes at least one surface mount device component mounted to one of the first side edge or another side edge of the plurality of side edges.