PCB Sidewall Shielding Structure for Full-Surface EMI Control
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Solution Overview
Problem
Existing electromagnetic interference (EMI) shielding technologies for printed circuit boards, such as metal shield cans and conformal shielding, require additional space and do not achieve perfect shielding from all sides, especially the side and lower surfaces.
Innovation Solution
A printed circuit board with an Embedded Trace Substrate (ETS) structure and a shielding layer covering its side surface, connected to the wiring layers, to enhance electromagnetic wave shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a metal shield can is applied for electromagnetic interference shielding, then shielding effectiveness is improved, but additional space on the printed circuit board is required
Solution Approach 1:
The shielding layer is merged with the wiring layers and insulating body to form an integrated structure. The shielding layer is disposed between the first and second wiring layers, combining the shielding function with the existing PCB structure without requiring additional space on the board surface.
Solution Approach 2:
The shielding approach transitions from a two-dimensional surface mounting (metal shield can on board surface) to a three-dimensional embedded structure within the PCB layers, utilizing the vertical dimension between wiring layers to achieve shielding without occupying additional board area.
2Object-affected harmful factors
If a metal shield can is applied for electromagnetic interference shielding, then shielding effectiveness is improved, but perfect shielding from side and lower surfaces cannot be achieved
Solution Approach 1:
The shielding structure is segmented into multiple parts: a shielding layer embedded between wiring layers, a seed layer connecting to the shielding layer, and wiring layers extending to the board edges. This segmentation allows the shielding effect to be distributed throughout the PCB structure, providing comprehensive coverage including side and lower surfaces.
Solution Approach 2:
The shielding layer is nested within the PCB structure between the first and second wiring layers, with the seed layer nested beneath the shielding layer. This nested arrangement creates multiple overlapping shielding barriers that provide complete electromagnetic interference protection from all directions.
3Object-affected harmful factors
If conformal shielding method is applied, then shielding is attempted, but additional process after package mounting is required and perfect shielding is not achieved
Solution Approach 1:
The shielding layer and seed layer are formed during the PCB manufacturing process before package mounting, rather than as an additional step after assembly. The layers are deposited and patterned in advance, integrating the shielding function into the base PCB structure and eliminating post-assembly processing steps.
Data Source
AI summary
A printed circuit board includes an insulating body having one surface and the other surface opposing each other, first and second wiring layers disposed on the one surface and the other surface of the insulating body, respectively, a seed layer disposed on the one surface of the insulating body and covering at least a portion of the first wiring layer, and a shielding layer covering a side surface of the insulating body and connected to the first and second wiring layers.