PCB Sidewall Plating for Via-Free Layer Transition Connections
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Solution Overview
Problem
Conventional printed circuit boards (PCBs) utilize through-hole vias for layer transitions, which block winding routing paths, leading to inefficient use of space, higher resistance, and reduced core areas in planar magnetic devices like inductors and transformers.
Innovation Solution
Sidewall plating is used to electrically connect conductive layers on PCBs, replacing layer transition vias, allowing for non-blocking connections and optimizing winding routing paths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If through-hole vias are used for layer transitions, then electrical connection between layers is achieved, but winding routing paths are blocked and space efficiency is reduced
Solution Approach 1:
The patent transitions from planar via connections to three-dimensional sidewall plating connections. The sidewall plating is formed on the vertical sidewalls of recesses between adjacent PCB layers, creating electrical connections in the vertical dimension rather than requiring holes through the layers. This dimensional shift eliminates blocking of winding routing paths while maintaining electrical connectivity between layers.
2Reliability
If through-hole vias are used for layer transitions, then electrical connection is established, but winding resistance increases due to blocked paths
Solution Approach 1:
By moving the connection method to the vertical sidewall dimension, the patent allows winding patterns to continue uninterrupted in the planar direction. The sidewall plating provides electrical connection between layers without creating obstacles in the winding routing paths, thereby reducing resistance and energy loss.
3Area of stationary object
If sidewall plating is used for layer transitions, then winding routing paths are optimized and core areas are increased, but manufacturing complexity increases
Solution Approach 1:
The sidewall plating is formed as part of the PCB layer fabrication process, specifically during the recess formation and plating stages that precede final assembly. By integrating the connection structure creation into the preliminary manufacturing steps, the patent avoids adding separate complex assembly operations, thereby managing manufacturing complexity while achieving the benefits of increased core area and optimized routing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances packaging efficiency, increases core areas, and reduces winding resistance by eliminating the need for layer transition vias, resulting in improved performance of planar magnetic structures.
Implementation Method 1
a plating on the first sidewall surface and the second sidewall surface and electrically connecting the first conductive layer and the second conductive layer
Data Source
AI summary
A circuit board including: a first board material layer having a first planar surface and a first sidewall surface perpendicular to the first planar surface; a first conductive layer on the first planar surface; a second board material layer stacked on the first board material layer and having a second planar surface and a second sidewall surface perpendicular to the second planar surface; a second conductive layer on the second planar surface; and a plating on the first sidewall surface and the second sidewall surface and electrically connecting the first conductive layer and the second conductive layer.