PCB Signal Line Capacitance Reduction via Bonding Sheet Extraction
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Solution Overview
Problem
Conventional printed circuit boards (PCBs) experience signal transmission losses due to bonding sheets with high dielectric constants surrounding signal transmission lines, which increase capacitance and hinder efficient electrical efficiency.
Innovation Solution
The design removes bonding sheet parts around signal transmission lines, reducing capacitance and signal loss by creating a structure with a first and second bonding sheet separated from the signal transmission line, allowing for increased width and reduced dielectric interference, and optionally incorporating additional bonding sheets and insulating layers to further minimize capacitance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If bonding sheets are placed around signal transmission lines to bond dielectric layers, then structural integrity and layer bonding are improved, but capacitance increases and signal transmission efficiency deteriorates
Solution Approach 1:
The bonding sheets are selectively removed from regions adjacent to signal transmission lines, extracting only the necessary bonding function from areas where it is not needed. This allows the bonding sheets to remain in non-critical areas for structural support while eliminating their harmful capacitive effect near signal lines, thereby resolving the contradiction between bonding strength and signal transmission efficiency
Solution Approach 2:
The bonding sheet configuration is made non-uniform, with bonding sheets present in some regions and absent in others. Specifically, bonding sheets are removed from regions adjacent to signal transmission lines while maintained in other areas. This local differentiation allows optimal bonding strength where needed while minimizing capacitance where signal transmission is critical
2Strength
If bonding sheets with high dielectric constant are used to bond dielectric layers, then bonding effectiveness is improved, but capacitance around signal transmission lines increases
Solution Approach 1:
Bonding sheets are selectively extracted from regions where their high dielectric constant creates harmful capacitance effects. The bonding sheets are removed from immediate proximity to signal transmission lines while potentially remaining in other areas, thus eliminating the harmful capacitive interference while preserving bonding effectiveness in non-critical regions
Solution Approach 2:
The bonding sheet distribution is made non-uniform to create different local properties: areas near signal transmission lines have no bonding sheets (low capacitance), while other areas maintain bonding sheets (high bonding effectiveness). This spatial variation in bonding sheet presence resolves the contradiction between bonding effectiveness and capacitance interference
3Area of stationary object
If bonding sheets are positioned close to signal transmission lines for compact structure, then device compactness is improved, but signal transmission loss increases
Solution Approach 1:
Bonding sheets are removed from regions adjacent to signal transmission lines, creating a deliberate spatial separation between bonding structures and signal paths. This extraction eliminates the source of signal transmission loss while the overall device compactness is maintained through optimized placement of remaining bonding sheets in non-interfering locations
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces signal transmission losses and increases the width of the signal transmission line, enhancing electrical efficiency by minimizing capacitance and dielectric interference.
Implementation Method 1
The first and second bonding sheets bond the first dielectric layer to the second dielectric layer
Data Source
AI summary
There is provided a printed circuit board (PCB) comprising a first ground layer extended in one direction; a first dielectric layer laminated on the first ground layer and extended in the same direction of the first ground layer; a signal transmission line laminated on the first dielectric layer and extended in the same direction of the first dielectric layer; a first bonding sheet disposed above the first dielectric layer; a second bonding sheet disposed above the first dielectric layer; a second dielectric layer disposed above the signal transmission line, the first bonding sheet, and the second bonding sheet; and a second ground layer laminated on the second dielectric layer.