PCB Simulation via Segmented Finite Element Modeling
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Solution Overview
Problem
Traditional methods for simulating printed circuit boards (PCBs) are time-consuming and computationally intensive due to the need for detailed modeling of embedded components, which can lead to excessive thermal stresses and catastrophic failures.
Innovation Solution
A method that generates independent finite element models for the dielectric board and embedded components, combining them to create a final model that reduces mesh complexity while ensuring accurate simulation by considering all components separately, thereby reducing engineering time and computational resources.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If traditional detailed modeling methods are used for embedded components in PCB simulation, then simulation accuracy is improved, but engineering time and computational resources are excessively consumed
Solution Approach 1:
The patent segments the PCB simulation model into two distinct parts: (1) a simplified macro-model for the entire PCB board, and (2) detailed micro-models only for embedded components. This segmentation allows the majority of the board to be modeled coarsely while only critical components receive detailed modeling, thereby reducing overall computational time while maintaining accuracy where needed.
Solution Approach 2:
The patent applies local quality by using different levels of modeling detail in different spatial locations. Embedded components that generate thermal stress are modeled with high detail locally, while the surrounding dielectric board and non-critical areas use simplified macro-modeling. This localized detailed approach ensures simulation accuracy at critical points without requiring full detailed modeling throughout the entire PCB.
2Measurement precision
If traditional detailed modeling methods are used for embedded components in PCB simulation, then simulation accuracy is improved, but computational model size increases excessively
Solution Approach 1:
The patent segments the computational model into a compact macro-model for the PCB board and separate detailed models only for embedded components. This segmentation prevents the entire computational model from becoming excessively large, as only critical components are modeled in detail while the rest of the board uses a simplified representation.
Solution Approach 2:
The patent applies local quality by concentrating detailed modeling resources only on embedded components where thermal stress analysis is critical, while using simplified macro-elements for the dielectric board. This approach maintains simulation accuracy at component locations without increasing the overall computational model size excessively.
3Productivity
If embedded components are homogenized in the simulation model, then computational resources are reduced, but simulation accuracy deteriorates
Solution Approach 1:
The patent applies local quality by treating embedded components differently from the surrounding dielectric board. While the board uses a homogenized macro-model for computational efficiency, the embedded components are explicitly modeled with their specific thermal and mechanical properties. This localized differentiation ensures that components that generate thermal stress are accurately represented without sacrificing overall computational efficiency.
Data Source
AI summary
Systems and methods for simulating a circuit board design include receiving a printed circuit board design comprising an electronic component and a dielectric board, generating a first finite element model of the dielectric board independent of the electronic component, and generating a second finite element model for the electronic component. The method further includes combining the first finite element model with the second finite element model to obtain a final finite element model for the printed circuit board design.