PCB Slit Structure and Impedance Matching for Signal Integrity
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Solution Overview
Problem
Printed circuit boards (PCBs) used in display devices often experience abrupt changes in impedance due to their structure, leading to signal distortion and deteriorated communication quality.
Innovation Solution
The implementation of a slit structure with a plurality of slits spaced apart for insulation between signal lines, combined with the use of impedance matching elements connected to the signal lines, helps mitigate abrupt impedance changes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a slit structure is used for insulation between signal lines, then insulation effectiveness is improved, but impedance change occurs
Solution Approach 1:
A ground line is introduced as an intermediary element between the signal line and the slit. This ground line acts as a mediator that provides a stable reference potential, preventing the signal line from being directly affected by the impedance disruption caused by the slit structure, thereby maintaining both insulation effectiveness and impedance stability
Solution Approach 2:
The grounding structure is applied locally at specific positions where signal lines cross or approach slits, rather than uniformly across the entire PCB. This localized grounding approach addresses impedance issues at critical points while maintaining the overall slit structure for insulation, optimizing the balance between insulation and impedance control
2Adaptability or versatility
If signal line passes over slit, then routing flexibility is improved, but signal quality deteriorates
Solution Approach 1:
A ground line is positioned between the signal line and the slit to serve as an intermediary that shields the signal line from the disruptive electromagnetic field of the slit. This mediator maintains the signal's integrity while allowing the signal line to pass over the slit, preserving both routing flexibility and signal quality
Solution Approach 2:
The ground line is strategically placed in advance before the signal line encounters the slit, creating a protective electromagnetic shield that cushions the signal from impending impedance disruptions. This preparatory grounding arrangement ensures signal quality is maintained throughout the crossing
Data Source
AI summary
Embodiments of the disclosure relate to a printed circuit board and a display device and, more specifically, may include a display panel and a printed circuit board directly or indirectly connected to the display panel and including a plurality of layers. The printed circuit board may include a first substrate layer, a second substrate layer disposed on the first substrate layer and having a slit formed in at least a portion thereof, a signal line disposed on the second substrate layer, disposed in a direction forming a predetermined angle from a longitudinal direction of the slit, and passing over the slit so that at least a portion thereof overlaps the slit on the same vertical line, and an impedance matching element connected to the signal line.