PCB Conductive Slit Layout for MLCC Vibration Noise Reduction
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Solution Overview
Problem
Existing electronic devices with printed circuit boards (PCBs) face noise issues due to the vibration of capacitors, particularly multilayer ceramic capacitors (MLCCs), which can cause discomfort through audible noise.
Innovation Solution
The electronic device incorporates a printed circuit board with a conductive layer featuring slits adjacent to the capacitor, and an insulation layer with portions within these slits. The slits are designed to be parallel to the capacitor's side surfaces and spaced a short distance apart, reducing noise by attenuating vibration energy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a conventional printed circuit board without slits is used, then the structure is simple and manufacturing is easy, but the capacitor generates audible noise due to vibration
Solution Approach 1:
The conductive layer is segmented by introducing slits that divide the continuous conductive path into separate sections. These slits create discontinuities in the conductive layer, allowing vibration energy to be dissipated through the heterogeneous media of the PCB structure, thereby reducing audible noise from capacitor vibration.
Solution Approach 2:
The slits are strategically positioned in specific areas adjacent to the capacitor rather than uniformly across the entire PCB. This localized modification creates heterogeneous media properties in the vicinity of the capacitor, enabling targeted vibration energy dissipation while maintaining the overall simplicity of the PCB structure.
2Volume of moving object
If the capacitor is placed close to other components to reduce device size, then space utilization improves, but vibration energy dissipation becomes less effective
Solution Approach 1:
The solution addresses vibration dissipation in the planar dimension by introducing slits within the conductive layer, rather than requiring additional space in the vertical dimension or远离 placement of the capacitor. The slits create heterogeneous media properties that enable vibration energy dissipation within the limited space available on the PCB surface.
3Reliability
If the conductive layer is made thicker to improve electrical performance, then electrical conductivity improves, but vibration energy dissipation through the conductive layer becomes less effective
Solution Approach 1:
The PCB structure utilizes the composite nature of multiple layers (conductive layers, insulation layers, and substrate materials) to dissipate vibration energy. The slits in the conductive layer create interfaces between different materials with varying mechanical properties, enabling effective vibration energy dissipation through the heterogeneous media while maintaining electrical performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces noise in the audible frequency band by dissipating the vibration energy of the capacitor through the PCB's heterogeneous media, resulting in a quieter operating environment.
Implementation Method 1
This configuration effectively reduces noise in the audible frequency band by dissipating the vibration energy of the capacitor through the PCB's heterogeneous media
Data Source
AI summary
An electronic device may include: a printed circuit board; and a capacitor disposed on the printed circuit board. The printed circuit board may include: a conductive layer including at least one slit in an area adjacent to the capacitor, and an insulation layer directly on the conductive layer and including a portion in the at least one slit. The at least one slit may be parallel to at least one side surface of the capacitor, and spaced apart from the at least one side surface of the capacitor by a first distance or less. The at least one slit may not overlap the capacitor when viewed from above.