PCB Slit Layout to Attenuate Speaker Return-Current H-Fields
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Solution Overview
Problem
The design of portable electronic devices with minimized gap between the printed circuit board and speaker causes H-fields due to return currents, leading to unintended speaker operation, which is difficult to attenuate due to the minimized distance.
Innovation Solution
Incorporating slits and protrusions on the printed circuit board to disrupt and attenuate the return current flow around the speaker, thereby reducing the intensity of H-fields.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a plurality of components are mounted on a printed circuit board, then the functionality of the electronic device is improved, but the probability of disconnection between components and the board increases
Solution Approach 1:
The patent applies preliminary action by forming reinforcement structures (protrusions and recesses) on the PCB before component mounting. These mechanical interlocking features are pre-integrated into the board design, ensuring that when components are subsequently mounted, they have enhanced connection stability and reduced disconnection probability from the outset.
2Adaptability or versatility
If the number of components and connections is increased, then the functionality is improved, but the complexity of the printed circuit board increases
Solution Approach 1:
The patent applies segmentation by dividing the connection interface into discrete reinforcement structures (protrusions on one side, recesses on the other). This modular approach to connection design allows the PCB to handle multiple components with standardized reinforcement patterns, reducing overall design complexity while supporting increased functionality.
3Productivity
If high-density connections are implemented, then the productivity and functionality are improved, but the manufacturing precision requirements increase
Solution Approach 1:
The patent applies local quality by concentrating reinforcement features at specific connection points rather than uniformly across the entire PCB. The protrusions and recesses are strategically placed at high-stress connection locations, providing enhanced precision where needed while maintaining standard manufacturing tolerances in other areas, thus enabling high-density connections without uniformly increasing precision requirements.
Data Source
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AI summary
An electronic device according to an embodiment of the disclosure may include: an electronic component including a coil therein; and a printed circuit board that is disposed to surround at least a part of the electronic component and includes plural slits disposed at preset intervals in at least one of regions facing the electronic component, wherein each of the plural slits may include a central slit portion extended along a center of the slit, and a symmetric slit portion extended to be symmetric with respect to the central slit portion.