PCB Slot Design for Ceramic Capacitor Vibration Noise

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Solution Overview

Problem

Printed circuit boards experience undesirable noise due to oscillations triggered by electronic components like ceramic capacitors and ferrite magnet coils, which propagate sound waves through the board, and existing solutions fail to effectively suppress these oscillations.

Innovation Solution

Incorporating slots in the printed circuit board, particularly running parallel to the side walls of electronic components, to interrupt the propagation of oscillations, ensuring they do not spread beyond the component's location, thereby suppressing surface and transverse waves.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-generated harmful factors

If slots are added to the printed circuit board to suppress oscillation propagation, then sound emission is reduced, but device complexity increases

Engineering Contradiction:
Improvesound emissionVSAvoidboard structure complexity
Core Design Contradiction:
Object-generated harmful factorsVSDevice complexity

Solution Approach 1:

The printed circuit board is segmented by introducing slots that divide the continuous board structure into separate regions. These slots act as barriers that segment the propagation path of mechanical oscillations, preventing them from traveling across the entire board and reducing sound emission.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The slots serve as intermediary elements between the sound-emitting component and the rest of the board. They act as a mediator that blocks the transmission of vibrational energy from the source to other parts of the system, thereby reducing noise without requiring direct modification of the component itself.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Object-generated harmful factors

If slots are introduced to interrupt oscillation propagation, then noise is suppressed, but manufacturing complexity increases

Engineering Contradiction:
Improveaudible noiseVSAvoidmanufacturing process simplicity
Core Design Contradiction:
Object-generated harmful factorsVSEase of manufacture

Solution Approach 1:

The board structure is segmented into discrete regions by the slots, which can be manufactured using standard PCB fabrication techniques such as laser cutting or mechanical routing. This segmentation approach maintains compatibility with existing manufacturing processes while achieving noise suppression.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The slots modify the physical parameters of the board structure by creating discontinuities in the continuous surface. By changing the geometric parameters (introducing gaps of specific dimensions), the propagation characteristics of mechanical waves are altered without fundamentally changing the manufacturing process.

Inventive Principle:
Principle #35Parameter changes

3Object-generated harmful factors

If the slot runs parallel to the side wall of the electronic component, then oscillation suppression efficiency is improved, but design flexibility is reduced

Engineering Contradiction:
Improveoscillation propagationVSAvoidslot positioning flexibility
Core Design Contradiction:
Object-generated harmful factorsVSAdaptability or versatility

Solution Approach 1:

The slot positioning is optimized for specific locations relative to sound-emitting components. By placing slots parallel to component side walls at critical positions, the design achieves targeted noise suppression where it is most needed, while maintaining flexibility in other areas of the board.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The slot orientation is aligned with the dimensional characteristics of the component (parallel to side walls) to maximize suppression efficiency in the primary direction of oscillation propagation. This dimensional alignment approach can be adapted to different component geometries and orientations as needed.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Effectively prevents the emission of sound by ensuring oscillations triggered by electronic components are contained within their immediate region of influence, reducing audible noise.

Implementation Method 1

the slot produces an interruption in the flat surface, with the result that surface waves and transverse oscillations of the printed circuit board beyond the slot are suppressed

Methodology Applied
Scientific EffectSurface wave propagation: Surface Acoustic Wave

Implementation Method 2

Ceramic capacitors demonstrate a piezoelectric effect. The material contracts under voltage and/or expands under voltage. Depending on the voltage applied, a movement can be introduced, in particular a periodic, i.e. oscillatory movement.

Methodology Applied
Scientific EffectPiezoelectric effect: Piezoelectric Effect

Implementation Method 3

the slot produces an interruption in the flat surface, with the result that surface waves and transverse oscillations of the printed circuit board beyond the slot are suppressed

Methodology Applied
Scientific EffectMechanical oscillation: Vibration

Data Source

PatentUS9119299B2Printed circuit board with vibration-generating electronic component
Publication Date: 2015.08.25 ABL IP HLDG LLC
  • US9119299B2 patent drawing
  • US9119299B2 patent drawing

AI summary

Surface mounted ceramic capacitors (14) on printed circuit boards (10′) are subject to vibrations (18) caused by the piezo effect. Other electronic components are subject to magnetostriction and likewise generate vibrations. In prior art, the vibrations can propagate (20) on a printed circuit board (10). To suppress the propagation of the vibrations caused by the electronic component (14), the invention provides at least one slot (22) in the printed circuit board (10′). The slot (22) extends, for example, parallel to a side wall of the electronic component (14).