Controlled-Depth PCB Slot Soldering for Memory Modules
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Solution Overview
Problem
Conventional memory device connections to circuit boards suffer from fretting issues due to external slots, leading to wear and premature failure, especially in vibration environments, and result in larger circuit board dimensions, limiting computing power and stacking capacity.
Innovation Solution
A circuit board with an internal controlled-depth slot and ½ radial plated through-holes for securing technology modules using solder, eliminating the need for external clips and reducing vibration-induced wear, allowing for smaller board dimensions and increased ruggedness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If an external slot with clips is used to secure the memory device, then the memory device can be easily installed and removed, but fretting and wear occur leading to premature failure
Solution Approach 1:
The patent replaces the mechanical clip-based securing system with a solder-based permanent connection. The memory device is secured to the circuit board through solder joints formed between the memory device contacts and the slot interconnects, eliminating the mechanical friction and wear associated with clip-based systems.
Solution Approach 2:
The patent merges the electrical interconnect function with the mechanical securing function into a single integrated slot structure. The same interconnects that provide electrical connection also serve as the mechanical anchor for the memory device, eliminating the need for separate securing mechanisms and reducing potential wear points.
2Reliability
If an external slot protrudes from the circuit board, then the memory device can be securely held, but the circuit board dimensions increase reducing stacking capacity
Solution Approach 1:
The patent nests the slot structure within the circuit board substrate rather than having it protrude externally. The slot is formed as an internal cavity or recess within the circuit board layers, allowing the memory device to be secured without increasing the overall external dimensions of the circuit board assembly.
Solution Approach 2:
The patent transitions from a two-dimensional surface-mounted slot to a three-dimensional internal slot structure embedded within the circuit board substrate. This vertical integration into the board thickness allows securement of the memory device without expanding the board's footprint or overall height.
3Reliability
If clips are used to lock the memory device, then the connection is secure, but the structure becomes more complex and larger
Solution Approach 1:
The patent extracts the separate clip-based locking mechanism from the slot structure, eliminating the need for additional moving parts, springs, or complex locking features. The securing function is achieved through the simple, static solder joints formed during the manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly reduces fretting and wear, enhances the service life of circuit board assemblies, and allows for more compact system designs and increased stacking density by securing technology modules with solderable interconnect features.
Implementation Method 1
A circuit board with an internal controlled-depth slot and ½ radial plated through-holes for securing technology modules using solder
Data Source
Figure 1A~1B
Figure 2
Figure 3A~3B
AI summary
According to exemplary embodiments, a controlled-depth slot extending into a circuit board is provided. The controlled depth slot may be milled, and may comprise ½ radial plated through-holes to generate a solderable "D" interconnect feature. The slot may include interconnect features on one to five sides. According to another exemplary embodiment, a circuit board having a depth-controlled interconnect slot is provided in conjunction with one or more solderable technology modules. The one or more solderable technology modules may include memory devices, power devices such as Point of Load Supplies (POLS), security devices and anti-tamper devices, capacitance devices, and other types of chips such as Field Programmable Gate Arrays (FPGAs). The solderable technology modules may be soldered into the slot to secure the modules in the slot and connect the modules to interconnects on the circuit board.