PCB Socket and Trace Layout for Flexible Die-to-Die Interconnects

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Solution Overview

Problem

Existing technologies for die-to-die connection in semiconductor packaging face limitations such as high costs, complex assembly processes, and reduced freedom in die arrangement due to the use of silicon interposers and embedded bridges.

Innovation Solution

A printed circuit board design that embeds a socket connected to a die through a trace in a substrate, allowing for improved die disposition by using a socket with offset connection pads and vias to enhance connectivity and flexibility.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If a silicon interposer is used for die-to-die connection, then the number of cores can be increased effectively, but the manufacturing cost increases and the assembly process becomes complicated

Engineering Contradiction:

Improvenumber of coresVSAvoidassembly process complexity

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The patent extracts the interconnection function from the complex silicon interposer structure and implements it directly through traces on the substrate. The substrate itself is modified to include embedded sockets and conductive traces, eliminating the need for a separate interposer layer and simplifying the overall assembly process while maintaining the ability to connect multiple dies.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The substrate is designed to serve multiple functions: it acts as both the mounting platform for dies and as the interconnection medium through embedded traces. The socket structure embedded in the substrate provides universal connectivity for different die configurations, allowing the same substrate design to support various core arrangements without requiring complex additional components.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Productivity

If a silicon interposer is used for die-to-die connection, then the number of cores can be increased effectively, but the manufacturing cost increases

Engineering Contradiction:

Improvenumber of coresVSAvoidmanufacturing cost

Core Design Contradiction:

ProductivityVSEase of manufacture

Solution Approach 1:

The patent merges the interposer functionality with the substrate structure by embedding sockets and traces directly into the substrate. This consolidation eliminates the need for separate interposer manufacturing and assembly steps, reducing overall manufacturing cost while maintaining the capability to support multiple cores through the integrated trace network.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent employs standard substrate materials and conventional trace fabrication processes instead of expensive silicon interposer materials. The substrate with embedded sockets serves as a cost-effective interconnection solution that achieves the required functionality without the high material and processing costs associated with silicon interposers.

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

3Reliability

If a silicon bridge is embedded in the substrate, then die-to-die connection can be achieved, but the degree of freedom in arrangement of dies is reduced

Engineering Contradiction:

Improvedie-to-die connectionVSAvoiddie arrangement flexibility

Core Design Contradiction:

ReliabilityVSAdaptability or versatility

Solution Approach 1:

The patent implements a dynamic trace network on the substrate that can accommodate various die arrangements. The embedded sockets are positioned to allow connections to dies at different locations, and the trace routing is designed to provide flexible signal paths that adapt to different die configurations, thereby maintaining both reliable connection and arrangement flexibility.

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The substrate is segmented into multiple regions with distributed embedded sockets and trace networks. This segmentation allows different sections of the substrate to support independent die placements, enabling flexible arrangement of dies while maintaining reliable interconnections through the distributed socket and trace structure.

Inventive Principle:

Principle #1Segmentation

4Reliability

If dies are positioned close to each other for bridge embedding, then die-to-die connection can be achieved, but the degree of freedom in arrangement of dies is reduced

Engineering Contradiction:

Improvedie-to-die connectionVSAvoiddie placement area

Core Design Contradiction:

ReliabilityVSArea of stationary object

Solution Approach 1:

The patent extends the connection capability beyond adjacent die positions by utilizing the substrate's planar area more effectively. Embedded sockets are positioned at multiple locations across the substrate, and traces are routed to connect dies that are not necessarily adjacent, thereby enabling die-to-die connection while allowing greater spatial separation and freedom in die placement arrangements.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS12593403B2Printed circuit board

Publication Date: 2026.03.31 SAMSUNG ELECTRO MECHANICS CO LTD

AI summary

A printed circuit board includes a substrate, a first pad and a second pad, respectively disposed on an upper side of the substrate, a first socket disposed in the substrate and including a first circuit, and a first trace disposed in the substrate and disposed between the first and second pads and the first socket with respect to a lamination direction. At least a portion of the first circuit is electrically connected to each of the first and second pads, and is electrically connected to the second pad through a path passing through the first trace.