PCB Solder Inspection Data Sharing via Unified Coordinates
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Solution Overview
Problem
Conventional solder paste inspection (SPI) and automated optical inspection (AOI) processes for printed circuit boards (PCBs) operate independently using two-dimensional and three-dimensional measurements respectively, making it difficult to share inspection results and establish effective inspection conditions, leading to pseudo-errors in defect judgment.
Innovation Solution
A board inspection apparatus system that acquires three-dimensional information of solder paste and solder joints, allowing for the transfer and modification of tolerances between SPI and AOI systems, enabling the sharing of inspection results and reducing pseudo-errors by adjusting inspection conditions based on shared three-dimensional measurement data.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If SPI and AOI processes operate independently using different measurement dimensions (3D for SPI, 2D for AOI), then each process can be performed separately with simple equipment, but inspection results cannot be shared and pseudo-errors occur in defect judgment
Solution Approach 1:
The patent merges the previously independent SPI and AOI inspection systems into an integrated system where both 3D solder paste inspection and 2D component mounting inspection are performed together. The key merging point is the unified coordinate system that allows 3D measurement data from SPI and 2D measurement data from AOI to be correlated and shared, enabling comprehensive defect judgment that eliminates pseudo-errors by combining information from both inspection dimensions.
Solution Approach 2:
The patent creates a universal inspection platform that performs multiple functions: it conducts both SPI (3D solder paste inspection) and AOI (2D component inspection) using a single integrated system. The unified coordinate system serves as a universal reference framework that enables different inspection types to share data and results, making the system multi-functional rather than requiring separate dedicated systems for each inspection type.
2Adaptability or versatility
If SPI uses three-dimensional measurement and AOI uses two-dimensional measurement, then each inspection method can focus on its specific defects, but it is difficult to apply inspection results from one process to the other
Solution Approach 1:
The patent bridges the dimensionality gap between 3D SPI measurement and 2D AOI measurement by introducing a unified coordinate system that integrates both dimensional spaces. This allows 3D solder paste inspection data to be projected and correlated with 2D component inspection data, enabling cross-inspection data transfer and application of inspection results across different measurement dimensions without losing the advantages of each specific inspection method.
3Measurement precision
If independent inspection tolerances are used in SPI and AOI, then each inspection can have optimized parameters, but pseudo-errors occur due to lack of coordination between tolerances
Solution Approach 1:
The patent implements feedback mechanisms where inspection results and tolerance validation information flow between SPI and AOI processes. When defects are detected in one inspection, the system provides feedback to adjust and coordinate tolerances in the other inspection. This feedback loop ensures that tolerance settings are consistent across both 3D and 2D measurements, eliminating pseudo-errors caused by uncoordinated tolerance thresholds while maintaining the measurement precision of each individual inspection method.
Data Source
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AI summary
A board inspection apparatus system includes a first apparatus, a second apparatus, a third apparatus and an information transfer section. The first apparatus acquires first three-dimensional information of a solder paste on a board, and inspects whether the solder paste is formed good by a first tolerance based on the first three-dimensional information. The second apparatus mounts an electronic component on the board to join the electronic component and the solder paste. The third apparatus acquires second three-dimensional information of a solder joint, and inspects whether the electronic component is mounted good by a second tolerance based on the second three-dimensional information. The information transfer section transfers the first three-dimensional information to the third apparatus, or transfers the second three-dimensional information to the first apparatus. Thus, a more effective inspection condition may be established, and a rate of defect for each apparatus may be greatly reduced.