PCB Solder Resist Gap for Reliable Optical Module Contact
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Solution Overview
Problem
The existing printed circuit boards face issues with poor contact between electro-conductive contact sheets and clamping pieces due to the presence of solder resist, which hinders electrical connection with other electronic components, especially in optical modules where precise contact is critical.
Innovation Solution
A printed circuit board design featuring a substrate with an electro-conductive contact sheet group and a solder resist layer, where a gap is maintained between the solder resist and the electro-conductive contact sheet group to prevent the solder resist from interfering with the clamping piece, ensuring proper electrical contact by adjusting the thickness and coverage of the solder resist.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solder resist is coated on the substrate to protect wiring patterns, then protection and oxidation resistance are improved, but electrical contact between electro-conductive contact sheets and clamping pieces deteriorates due to insulating interference
Solution Approach 1:
The solder resist coating is segmented to create a gap between the electro-conductive contact sheet group and the clamping piece area. This segmentation allows the solder resist to protect the wiring patterns while leaving the contact area exposed for proper electrical connection.
Solution Approach 2:
The solder resist is applied with different coverage characteristics in different regions: it coats the wiring patterns for protection but intentionally leaves the contact area between the electro-conductive contact sheets and clamping pieces uncovered, creating local quality differentiation to resolve the contradiction.
2Duration of action of stationary object
If solder resist coverage is increased to enhance protection, then durability is improved, but electrical conductivity and contact reliability worsen due to solder resist interference
Solution Approach 1:
The solder resist coverage is segmented into protected areas (wiring patterns) and unprotected areas (contact regions). This segmentation ensures durability where needed while maintaining electrical contact reliability where clamping pieces interface with electro-conductive contact sheets.
Solution Approach 2:
Different regions of the substrate receive different treatments: wiring pattern areas are coated with solder resist for durability, while contact areas maintain exposed electro-conductive surfaces for reliable electrical connection.
3Area of stationary object
If electro-conductive contact sheets are positioned close to wiring patterns for compact design, then device compactness is improved, but contact reliability deteriorates due to solder resist interference
Solution Approach 1:
The solder resist application is segmented to stop before reaching the electro-conductive contact sheet group, creating a gap that ensures reliable contact while allowing compact positioning of components on the circuit board.
Solution Approach 2:
The solder resist provides localized protection to wiring patterns while intentionally leaving the contact region between electro-conductive contact sheets and clamping pieces exposed, enabling compact design without compromising contact reliability.
Data Source
AI summary
The application provides a printed circuit board and an optical module so as to alleviate poor contact between the electro-conductive contact sheet group and the clamping piece due to the solder resist. The printed circuit board includes a substrate, and electro-conductive contact sheet group positioned on the surface of the substrate, where a part of the substrate is overlaid with solder resist, and there is a gap between the solder resist and the electro-conductive contact sheet group.