PCB Solid-State Relay Layout for Fast High-Current Switching

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Solution Overview

Problem

Existing electromechanical relays used in vehicle systems are large, have slow switching speeds, suffer from contact welding, and require manual replacement, making them inefficient for high current and voltage applications.

Innovation Solution

A PCB-based bi-directional solid state relay is developed, utilizing field effect transistors or insulated gate bipolar transistors, which are scalable, have low on-resistance, and fast response times, eliminating the need for mechanical components and allowing for voltage, temperature, and current sensing, with a control module for switch protection.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If electromechanical relays are used in vehicle systems, then high current and voltage control is achieved, but the device size is large, switching speed is slow, and mechanical contact welding occurs

Engineering Contradiction:
Improveswitching reliabilityVSAvoidmechanical structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent replaces electromechanical relays with solid-state switches (MOSFETs or IGBTs) implemented on PCBs, eliminating mechanical moving parts and contacts. This substitution resolves the contradiction by maintaining high current/voltage control capability while removing mechanical complexity and contact welding issues, achieving faster switching speeds and improved reliability.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the fundamental operating parameters from mechanical to solid-state by using semiconductor devices with different physical characteristics. The solid-state switches operate without mechanical movement, enabling faster switching speeds (microseconds vs. milliseconds) and eliminating contact wear, thereby improving reliability while reducing device complexity.

Inventive Principle:
Principle #35Parameter changes

2Power

If electromechanical relays are used, then high current control is achieved, but contact welding occurs and manual replacement is required

Engineering Contradiction:
Improvecurrent handling capabilityVSAvoidmaintenance requirement
Core Design Contradiction:
PowerVSEase of repair

Solution Approach 1:

The patent replaces mechanical relay contacts with solid-state semiconductor switches that have no moving parts. This eliminates contact welding entirely while maintaining the ability to handle high currents through parallel-connected MOSFETs or IGBTs. The solid-state nature also enables automated replacement and reduces maintenance requirements.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The solid-state relay design incorporates protection circuits and control logic that automatically manage switching operations and fault detection. This self-service capability reduces the need for manual intervention and repair, as the system can detect and respond to abnormal conditions without human assistance.

Inventive Principle:
Principle #25Self-service

3Ease of manufacture

If solid state switches are implemented on separate PCBs, then scalability and low on-resistance are achieved, but device assembly complexity increases

Engineering Contradiction:
ImprovescalabilityVSAvoidPCB assembly complexity
Core Design Contradiction:
Ease of manufactureVSDevice complexity

Solution Approach 1:

The patent merges multiple separate PCBs into a single integrated PCB assembly containing all solid-state switches (first and second solid state switches). This consolidation maintains the scalability and low on-resistance benefits of multiple parallel switches while simplifying the overall device assembly by eliminating the need to assemble and connect separate PCBs, thereby reducing assembly complexity.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The integrated PCB design serves multiple functions simultaneously: it provides the switching elements, the interconnections between switches, the mounting structure, and the electrical pathways. This multi-functionality achieves scalability and low on-resistance while avoiding the additional complexity of assembling separate PCBs, as the single PCB performs all necessary roles.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The PCB-based solid state relay effectively blocks high voltage and current, offers fast switching, and is scalable, reducing size and cost while eliminating the need for manual replacement and mechanical parts, enhancing efficiency and reliability in vehicle systems.

Implementation Method 1

A PCB-based solid state relay may be implemented using field effect transistors or insulated gate bipolar transistors

Methodology Applied
Scientific EffectField effect transistor operation:

Implementation Method 2

A PCB-based solid state relay may be implemented using field effect transistors or insulated gate bipolar transistors

Methodology Applied
Scientific EffectInsulated gate bipolar transistor operation:

Data Source

PatentUS11765815B2Printed circuit board based solid state relay
Publication Date: 2023.09.19 GM GLOBAL TECHNOLOGY OPERATIONS LLC
  • US11765815B2 patent drawing
  • US11765815B2 patent drawing
  • US11765815B2 patent drawing

AI summary

A bi-directional solid state switch includes: a first bus bar; a second bus bar; a first solid state switch implemented on a first printed circuit board (PCB), the first solid state switch including: a first control terminal; a first terminal electrically connected to the first bus bar; and a second terminal; and a second solid state switch implemented on a second PCB, the second solid state switch including: a second control terminal; a third terminal electrically connected to the second terminal of the first solid state switch; and a fourth terminal electrically connected to the second bus bar.