PCB-Spaced Oscillator Structure for Frequency Stability Under Heat

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Solution Overview

Problem

Quartz oscillators in electronic devices are vulnerable to temperature changes, leading to frequency instability, especially in small-sized devices that cannot easily dissipate heat, limiting temperature compensation effectiveness.

Innovation Solution

An electronic device with an oscillator structure that includes a piezoelectric material and a connection member with conductive patterns to space the oscillator apart from the printed circuit board, enhancing thermal capacity and reducing temperature-induced frequency changes through a conductive pattern and pad configuration.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the oscillator is mounted directly on the printed circuit board, then the electrical connection is simple, but the temperature changes severely causing frequency instability

Engineering Contradiction:
Improvefrequency stabilityVSAvoidconnection structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

A connection member is introduced as an intermediary component between the oscillator and the printed circuit board. This connection member includes a first pad part connected to the oscillator terminal, a second pad part connected to the PCB pad, and conductive patterns that electrically connect these pad parts. The intermediary structure allows thermal isolation while maintaining electrical connectivity, thereby resolving the contradiction between frequency stability and connection simplicity.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Measurement precision

If temperature compensation elements are added to the quartz oscillator, then the temperature measurement capability is improved, but the device size increases and heat dissipation becomes difficult

Engineering Contradiction:
Improvetemperature measurement capabilityVSAvoiddevice size
Core Design Contradiction:
Measurement precisionVSVolume of moving object

Solution Approach 1:

The temperature compensation function is extracted from the oscillator housing and implemented separately on the printed circuit board. The temperature compensation element is mounted on the PCB rather than being integrated into the oscillator body, allowing the oscillator to remain compact while still providing temperature measurement capability through the separate compensation element and associated circuitry.

Inventive Principle:
Principle #2Taking out (Extraction)

3Temperature

If the oscillator is spaced apart from the printed circuit board, then the thermal capacity is increased reducing temperature-induced frequency changes, but the electrical connection becomes more complex

Engineering Contradiction:
Improvethermal capacityVSAvoidconnection structure complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The connection member serves as a mediator that enables both thermal isolation and electrical connectivity. By spacing the oscillator apart from the PCB and using the connection member with its conductive patterns, the system increases thermal capacity to reduce temperature-induced frequency changes while maintaining manageable electrical connection complexity through the structured pad and conductive pattern design.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively reduces the magnitude of temperature changes in the oscillator, improving frequency stability and precision by increasing thermal capacity and maintaining efficient electrical connectivity.

Implementation Method 1

The quartz oscillator uses a piezoelectric effect of quartz pieces. If an alternating current (AC) voltage is applied to a quartz piece cut in a specific direction with respect to an axis of a quartz crystal, vibration is caused by a deformation force due to a piezoelectric phenomenon.

Methodology Applied
Scientific EffectPiezoelectric effect: Piezoelectric Effect

Implementation Method 2

a connection member disposed between the oscillator and the printed circuit board such that the oscillator is spaced apart from a surface of the printed circuit board to electrically connect the oscillator to the printed circuit board

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS11363718B2Oscillator structure and electronic device including the same
Publication Date: 2022.06.14 SAMSUNG ELECTRONICS CO LTD
  • US11363718B2 patent drawing
  • US11363718B2 patent drawing
  • US11363718B2 patent drawing

AI summary

An electronic device and oscillator structure are provided. The electronic device includes a printed circuit board, an oscillator configured to oscillate at a frequency corresponding to an operation clock of the electronic device, and a connection member disposed between the oscillator and the printed circuit board such that the oscillator is spaced apart from a surface of the printed circuit board to electrically connect the oscillator to the printed circuit board. The connection member includes a first pad part electrically connected to a terminal of the oscillator, a second pad part electrically connected to a pad of the printed circuit board, and at least one conductive pattern electrically connecting the first pad part and the second pad part.