PCB Assembly Spring Clip Heat Dissipation Plate Anti-Sag
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Solution Overview
Problem
Conventional liquid crystal displays (LCDs) face challenges in efficiently dissipating heat from high-performance time controllers, leading to elevated operating temperatures and board sagging due to the weight of heat dissipation components.
Innovation Solution
A printed circuit board assembly is designed with a heat dissipation plate, thermal interface material, and a spring clip or hook springs to enhance heat dissipation and prevent sagging, incorporating a protection plate and fixing members to secure the heat dissipation plate and spring clip in place.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a thermal pad is attached to the time controller to dissipate heat, then heat dissipation is improved, but the operating temperature remains too high (180°C) and the board sags due to the weight of the thermal pad
Solution Approach 1:
The heat dissipation system is segmented into multiple functional components: a thermal pad for heat transfer, a heat dissipation plate for heat distribution, and spring clips with hook springs for mechanical support. This segmentation allows each component to address specific aspects of the heat dissipation and support problem independently, preventing board sagging while maintaining effective heat transfer.
Solution Approach 2:
The solution transitions from a two-dimensional thermal pad attachment to a three-dimensional heat dissipation structure involving a heat dissipation plate and spring clips. This dimensional change provides both thermal management functionality and mechanical support, eliminating board sagging while improving heat dissipation efficiency.
2Temperature
If a heat dissipation plate is added to improve heat dissipation, then temperature control is improved, but the weight increases causing board sagging
Solution Approach 1:
The spring clips with hook springs provide an upward supporting force that counteracts the downward weight of the heat dissipation plate and thermal pad. This anti-weight mechanism allows the system to carry the necessary heat dissipation components without causing board sagging, as the elastic force of the springs balances the gravitational force.
Solution Approach 2:
The spring clips utilize elastic deformation parameters to provide dynamic support. By changing the elastic force parameter of the spring clips, the system can support varying weights of heat dissipation components while maintaining board stability, allowing effective heat dissipation without permanent board deformation.
3Length of moving object
If the board thickness is reduced to achieve a thin profile, then the thinness is improved, but the board sags under the weight of the time controller and thermal pad
Solution Approach 1:
The spring clips provide an upward elastic force that counteracts the weight of mounted components, allowing the board to maintain its thin profile without sagging. The hook springs engage with the heat dissipation plate assembly, creating a support system that compensates for the reduced structural rigidity of the thin board.
Solution Approach 2:
The spring clips act as an intermediary mechanical element between the thin board and the mounted components. They transfer and distribute the mechanical load from the time controller and heat dissipation assembly to the board, preventing direct stress concentration that would cause sagging in the thin board structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces the operating temperature of the time controller by up to 110°C and prevents board sagging, ensuring reliable operation and improved heat dissipation performance.
Implementation Method 1
a thermal interface material disposed between the semiconductor device and the heat dissipation plate
Implementation Method 2
hook springs which bring the semiconductor device and the heat dissipation plate into close contact with each other; and a spring clip, which is disposed on a second surface opposite the first surface of the board
Data Source
AI summary
A printed circuit board assembly and a liquid crystal display (“LCD”) having the same, and more particularly, to a printed circuit board assembly, wherein a board mounted with a heat dissipation plate and a time controller using a spring clip or a hook spring can prevent the board from sagging. An exemplary embodiment includes a heat dissipation plate, a protection plate and a thermal interface material to dissipate heat from a time controller, thereby efficiently dissipating heat from the time controller. Another exemplary embodiment includes a spring clip or a hook spring to increase contact forces among a protection plate, a heat dissipation plate and a board, thereby further improving heat dissipation performance. Exemplary embodiments of the present invention make it possible to provide a printed circuit board assembly, wherein a spring clip supports the bottom of a region of a board in which a time controller is mounted, thereby preventing sagging of the region of the board in which the time controller and a heat dissipation plate are mounted. An LCD having the printed circuit board assembly is also described.