PCB Interconnect System Using Spring Contact for Solder-Free Connection
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Solution Overview
Problem
Existing connection systems for circuit boards are complex and often result in imperfect solder joints, which are economically and ecologically disadvantageous, and require chemicals and tools for manufacturing.
Innovation Solution
A connection system utilizing conductive films on a circuit board with V-shaped spring elements that establish galvanic contact without soldering, using elastic contact springs to grip the films and form secure connections without tools or chemicals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solder joints are used to connect circuit boards, then reliable electrical connection is achieved, but manufacturing complexity increases and environmental impact worsens due to required chemicals and energy
Solution Approach 1:
The patent extracts and eliminates the solder joint from the connection system, replacing it with a direct mechanical and electrical connection between spring contact elements and circuit board contact elements. This removes the need for soldering chemicals, heating equipment, and associated manufacturing complexity while maintaining reliable electrical connection through the spring's continuous contact pressure.
Solution Approach 2:
The patent replaces the thermal-chemical soldering process with a purely mechanical connection system. The spring contact elements apply continuous mechanical pressure to establish and maintain electrical contact with the circuit board, substituting the thermal energy and chemical processes of soldering with a mechanical force-based system.
2Reliability
If solder joints are used to connect circuit boards, then electrical connection is established, but ecological disadvantage increases due to use of chemicals and energy
Solution Approach 1:
The patent extracts and eliminates the harmful elements (soldering chemicals, heating energy) from the connection process, replacing them with a mechanical spring-based system that achieves reliable galvanic contact without environmental harm. The spring contact elements directly press against the circuit board contacts to establish electrical connection.
Solution Approach 2:
The patent converts the potential harm of complex manufacturing processes into benefit by using a simple spring mechanism that naturally provides both mechanical retention and electrical contact. The spring's elastic properties transform what would be a simple retention mechanism into a dual-function component that ensures both mechanical strength and reliable galvanic contact.
3Reliability
If soldering process is used, then connection is established, but manufacturing time and energy consumption increase
Solution Approach 1:
The patent extracts the time-consuming soldering process from the manufacturing sequence, replacing it with a rapid spring-installation process. The spring contact elements can be directly attached to the circuit board without requiring soldering setup, heating cycles, or cooling time, significantly reducing manufacturing time while maintaining connection quality.
Solution Approach 2:
The spring contact elements are pre-formed with specific geometric configurations (V-shaped legs, contact surfaces) that enable direct attachment to the circuit board. This preliminary preparation allows the springs to be installed and functionalized in a single step without requiring the multiple stages of soldering preparation, execution, and finishing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables simple, tool-free, and chemical-free connection of coaxial cables to circuit boards, ensuring high-quality galvanic contacts and reducing manufacturing complexity and environmental impact.
Implementation Method 1
The first spring and the second spring are designed in such a way that galvanic contact is established between the spring and the conductive film by means of the pressure of the first spring on the first conductive film and by the pressure of the second spring on the second conductive film
Data Source
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AI summary
The invention relates to an interconnect system for a printed circuit board (1) having at least one first connecting element (2) and one second connecting element (3). The first connecting element (2) is formed of a first conductive film (21) and a second conductive film (22). The first conductive film (21) is printed on a first side (A) of the printed circuit board (1), whereas the second conductive film (22) is printed on a second side (B) of the printed circuit board (1). The invention provides that the second connecting element (3) is comprised of a first spring (31) and a second spring (32). The first spring (31) and the second spring (32) are constructed such that with the first spring (31) exerting pressure on the first conductive film (21), and the second spring (32) exerting pressure on the second conductive film (22), a respective galvanic contact of spring (31, 32) and conductive film (21, 22) is made.