PCB Square Wave Plated-Through Holes Reduce Impedance
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Solution Overview
Problem
Existing connections between printed circuit boards, whether direct or indirect, often result in compromised mechanical stability and limited edge length, leading to suboptimal impedance and increased resistance due to solder joints and connector restrictions.
Innovation Solution
Interconnecting printed circuit boards using a square wave pattern of plated-through holes, secured by copper U-shaped clips, to reduce impedance and enhance mechanical stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If direct connections with solder joints are used between PCBs, then electrical connection is achieved, but mechanical stability is compromised and flexural/shear strength is reduced
Solution Approach 1:
The connection interface is segmented into multiple plated-through holes arranged in a square wave pattern, with each hole providing a discrete connection point. This segmentation distributes the mechanical load across multiple points rather than relying on a continuous solder joint, thereby maintaining electrical connectivity while improving flexural and shear strength.
Solution Approach 2:
The invention changes the geometric parameters of the connection structure by using a square wave pattern of plated-through holes instead of traditional solder joints. This parameter change transforms the connection from a soft, compliant solder joint to a rigid, structurally sound mechanical connection that maintains both electrical and mechanical integrity.
2Reliability
If traditional connection methods are used, then PCBs can be connected, but impedance is not optimized and resistance is increased
Solution Approach 1:
The connection interface is divided into multiple discrete plated-through holes arranged in a square wave pattern, creating multiple parallel current paths. This segmentation reduces the overall resistance and impedance by distributing current flow across multiple conductive pathways, thereby optimizing electrical performance.
Solution Approach 2:
The invention transitions from traditional planar solder joint connections to a three-dimensional arrangement of plated-through holes extending through the PCB substrate. This dimensional change creates vertical conductive pathways that reduce current density and impedance in the connection interface.
3Reliability
If connectors are used for indirect connections, then electrical connection is achieved, but component placement flexibility is restricted
Solution Approach 1:
The invention extracts and eliminates the connector intermediary from the connection system, implementing direct PCB-to-PCB connections through plated-through holes. This extraction removes the spatial and design constraints imposed by connectors, thereby maximizing component placement flexibility while maintaining reliable electrical connection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method significantly decreases impedance and improves mechanical stability by creating a more efficient current flow path and increased flexibility in component placement, with impedance reduced from 50 milliohms to 0.5 milliohms when using a square wave pattern.
Implementation Method 1
producing plated-through holes along the square wave pattern of the adjoined first printed circuit board and second printed circuit board... the plated-through holes may decrease an impedance of the printed circuit board
Implementation Method 2
securing a top section of the adjoined first printed circuit board and second printed circuit board using a first metal clip and securing a bottom section of the adjoined first printed circuit board and second printed circuit board using a second metal clip
Implementation Method 3
connecting the first printed circuit board to the second printed circuit board to form a connected first printed circuit board and second printed circuit board by soldering along the square wave pattern using a wave soldering process
Data Source
AI summary
Disclosed are a method and system to reduce impedance of printed circuit boards through an interconnecting of printed circuit boards using a square wave pattern of plated-through holes. A method of connecting a first printed circuit board to a second printed circuit board comprises forming a square wave pattern of the first printed circuit board and the second printed circuit board and adjoining the first printed circuit board and the second printed circuit board. The method also involves producing plated-through holes along the square wave pattern, a top section, and/or a bottom section of the adjoined first printed circuit board and second printed circuit board. The method further involves securing the top section and the bottom section using a first metal clip and a second metal clip, respectively, and connecting the first printed circuit board to the second printed circuit board by a wave soldering process.