PCB Stack Structure Using Elastic Connector for Repairable Assembly

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Solution Overview

Problem

Conventional printed circuit board (PCB) stack structures face issues with component damage and warpage due to high-temperature reflow processes during surface mounting technology (SMT) and are difficult to disassemble for repair.

Innovation Solution

A separable printed circuit board stack structure is formed using a connector with conductive elastic pieces and a detachable locking component, eliminating the need for SMT processes and allowing for easy disassembly and reassembly.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If SMT process with high temperature reflow is used to connect PCBs through solder balls, then electrical connectivity between PCBs is achieved, but component damage and warpage occur due to thermal stress

Engineering Contradiction:
Improveelectrical connectivityVSAvoidcomponent damage and warpage
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent replaces the thermal soldering process with a mechanical connection system. A connector with elastic pieces makes direct mechanical contact with conductive patterns on PCB pads, establishing electrical connectivity without high-temperature reflow. This mechanical substitution eliminates thermal stress on components while maintaining reliable electrical connection.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent introduces a connector as an intermediary component between two PCBs. This connector includes elastic pieces that contact conductive patterns on PCB pads, serving as a mediator to transfer electrical signals without requiring direct solder joint between PCBs. The intermediary connector isolates the PCBs from direct thermal exposure during assembly.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If PCBs are soldered to interposer through solder balls, then stack structure is formed, but disassembly for repair becomes difficult

Engineering Contradiction:
Improvestack structure formationVSAvoiddisassembly difficulty
Core Design Contradiction:
ReliabilityVSEase of repair

Solution Approach 1:

The patent employs elastic pieces within the connector that provide dynamic, reversible mechanical contact rather than permanent solder joints. These elastic pieces can be compressed during assembly to establish contact with PCB pads, and the same elastic pieces can be released during disassembly to allow separation. This dynamic mechanical connection enables both reliable stack formation and easy disassembly for repair.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The patent segments the connection system into separate, modular components: a connector with elastic pieces that interfaces with conductive patterns on PCB pads. This segmentation allows the connector to be independently removed and replaced without damaging the PCBs themselves, facilitating repair and maintenance while maintaining stable electrical connection during operation.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution prevents component damage and warpage, facilitates easy repair, and maintains electrical connectivity without the need for high-temperature soldering, enhancing the reliability and maintainability of electronic products.

Implementation Method 1

The first conductive elastic piece is on the first surface and in electrical contact with the first pad

Methodology Applied
Scientific EffectElasticity: Elasticity

Data Source

PatentUS10952325B2Printed circuit board stack structure and method of forming the same
Publication Date: 2021.03.16 UNIMICRON TECH CORP
  • US10952325B2 patent drawing
  • US10952325B2 patent drawing
  • US10952325B2 patent drawing

AI summary

A printed circuit board (PCB) stack structure and method of forming the same are provided. The printed circuit board stack structure includes a first PCB, a second PCB and a connector. The first PCB includes a first pad. The second PCB includes a second pad. The connector has an annular structure, located between the first PCB and the second PCB and electrically connecting the first PCB to the second PCB. The connector includes a substrate, a first conductive elastic piece and a second conductive elastic piece. The substrate has a first surface and a second surface opposite to each other. The first conductive elastic piece is located on the first surface and in electrical contact with the first pad. The second conductive elastic piece is located on the second surface and in electrical contact with the second pad.