PCB Stack Shielding for Interference Immunity
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Solution Overview
Problem
Existing miniaturized sensors face challenges in achieving high interference immunity with minimal structural complexity, as conventional shielding methods require significant effort and may not effectively protect sensitive circuit parts from external electrical interference.
Innovation Solution
A compact sensor design featuring a printed circuit board stack with interference-sensitive components enclosed within, utilizing a shielding sleeve and ground layers to protect against external interference, and additional ground connections via a frame printed circuit board for enhanced immunity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional shielding methods (metalized housing, shielding film, soldered contacts) are used to protect sensitive circuit parts, then interference immunity is improved, but device complexity and structural effort increase
Solution Approach 1:
The patent combines multiple shielding functions into the printed circuit board stack itself. The ground layers integrated into the PCB layers and the frame PCB with ground lines create a unified shielding structure that protects sensitive circuit parts without requiring separate shielding components, thereby reducing device complexity while maintaining interference immunity
Solution Approach 2:
The printed circuit board stack serves multiple functions: it provides mechanical support, electrical connections, and electromagnetic shielding. The ground layers and frame PCB structure simultaneously act as both circuit interconnects and interference barriers, eliminating the need for dedicated shielding structures and reducing overall device complexity
2Volume of moving object
If miniaturized sensor design is implemented, then device size is reduced, but achieving high interference immunity becomes more difficult
Solution Approach 1:
The patent implements nesting by placing sensitive circuit parts within the interior space formed by the printed circuit board stack. The frame PCB and ground layers are nested around the sensitive components, creating a compact shielded enclosure that provides high interference immunity within a miniaturized sensor design
Solution Approach 2:
The patent uses multiple stacked PCB layers with integrated ground layers to create three-dimensional shielding. This vertical stacking approach allows effective interference protection without increasing the horizontal footprint, enabling miniaturized sensor design while maintaining high interference immunity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves high immunity to conducted interference, allowing for a miniaturized sensor design that meets stringent interference radiation requirements with reduced structural complexity.
Implementation Method 1
circuit parts susceptible to interference are located in the interior space on at least one inside of one of the printed circuit boards, which circuit parts are protected from external interference by the printed circuit board stack
Data Source
AI summary
The sensor has a sensor unit (7) i.e. ultrasound transducer, surrounded by a shield (14) i.e. shield casing, and a printed circuit board stack formed by three printed circuit boards (8, 9, 10). The printed circuit board stack includes an inner space, where circuit portions i.e. amplifiers, susceptible to interference lie in the inner space and on an inner side of one of the printed circuit boards such that the circuit portions are protected by the printed circuit board stack against the electromagnetic interference from outside.