PCB-Stacked Antenna Feeding Via Interposer Via and Shielding
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Solution Overview
Problem
Portable electronic devices face spatial restrictions and performance issues with antenna placement due to miniaturization and increased battery capacity, leading to interference and elevated manufacturing costs, particularly when using interposer methods for PCB stacking.
Innovation Solution
The use of a conductive via in an interposer to power feed antennas, combined with non-conductive materials to prevent interference and enhance antenna performance, allowing for impedance tuning and resistance to external impacts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If an antenna component is placed inside the electronic device in the space where PCBs are stacked, then wireless communication function is achieved, but antenna radiation is interfered with due to metallic material on PCBs and antenna performance deteriorates
Solution Approach 1:
The patent introduces an interposer as an intermediary component between the PCBs and the antenna. This interposer includes a ground portion and a non-conductive portion that acts as a mediator to isolate the antenna from harmful electromagnetic interference generated by the PCBs, thereby protecting antenna performance while maintaining wireless communication functionality
Solution Approach 2:
The patent converts the harmful electromagnetic interference from PCB metallic materials into a beneficial shielding effect by strategically positioning ground portions of the interposer. The ground portion acts as a shield that redirects and contains electromagnetic interference away from the antenna, transforming the harmful radiation into a protective barrier
2Ease of operation
If the antenna carrier is designed to have an inclination angle of 60° or more to connect PCBs to the antenna, then electrical connection is achieved, but the antenna becomes vulnerable to impact and manufacturing costs increase
Solution Approach 1:
The patent transitions from a two-dimensional planar connection approach to a three-dimensional stacked configuration using the interposer. This vertical arrangement allows electrical connections to be established through conductive vias in the interposer without requiring large inclination angles, thereby maintaining connection efficacy while improving impact resistance and reducing manufacturing complexity
3Volume of moving object
If the electronic device is miniaturized and battery capacity is increased, then device compactness and energy storage are improved, but it becomes difficult to secure space for antenna components and spatial restrictions increase
Solution Approach 1:
The patent implements a nested structure where the interposer is positioned within the existing PCB stack, and the antenna is integrated into the same vertical space. This nesting approach allows the antenna system to occupy minimal additional volume by utilizing the interstitial space between PCB layers, thereby achieving compact antenna integration without compromising device miniaturization or battery capacity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables efficient power feeding and improved antenna performance within spatial constraints, reducing interference and manufacturing costs while maintaining effective wireless communication.
Implementation Method 1
a conductive via connecting the first PCB and the second PCB, and the wireless communication circuit may be configured to transmit and/or receive a signal of a specified frequency band by feeding power to the antenna via the conductive via
Implementation Method 2
a ground portion configured to provide shielding for at least one electronic component disposed in the electronic device
Implementation Method 3
a non-conductive portion located adjacent to the ground portion and including a dielectric material
Data Source
AI summary
An electronic device according to various embodiments comprises: a first printed circuit board (PCB); a second PCB disposed to be spaced apart from the first PCB; an interposer encompassing the space between the first PCB and the second PCB; an antenna; a conductive connecting member comprising a conductive material electrically connecting the second PCB and the antenna; and a wireless communication circuit electrically connected to the first PCB, wherein the interposer includes a ground portion configured to provide shielding for least one electronic component disposed in the electronic device, and a non-conductive portion positioned to be adjacent the ground portion and including a dielectric material, the non-conductive portion of the interposer includes a conductive via configured to connect the first PCB and the second PCB, and the wireless communication circuit is configured to transmit and/or receive a signal having a designated frequency band by feeding electricity to the antenna through the conductive via.